XC7K410T-1FBG676I
IC FPGA 400 I/O 676FCBGA
Quick Answer: The XC7K410T-1FBG676I from AMD is a Kintex-7 field programmable gate array (FPGA) in a 676-BBGA, FCBGA surface-mount package.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 676-BBGA, FCBGA
- Stock
- 1,463 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 676-FCBGA (27x27) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K410T-1FBG676I.
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Detailed Description for XC7K410T-1FBG676I
Product Overview
The XC7K410T-1FBG676I from AMD is a Kintex-7 field programmable gate array (FPGA) in a 676-BBGA, FCBGA surface-mount package. The device provides 400 I/O, 406,720 logic elements/cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits. It operates from a 0.97 V to 1.03 V supply and is specified for a junction temperature range of -40°C to 100°C (TJ). The 400 I/O and 676-FCBGA (27 x 27) package support programmable logic, data buffering, and interface control tasks in embedded systems.
Key Features
- AMD Kintex-7 FPGA architecture
- 400 I/O for configurable external interfacing
- 406,720 logic elements/cells
- 31,775 LABs/CLBs
- 29,306,880 total RAM bits
- 0.97 V to 1.03 V supply voltage
- Surface-mount 676-BBGA, FCBGA package
- 676-FCBGA (27 x 27) device package
- -40°C to 100°C (TJ) operating temperature
Applications
- Programmable logic in embedded systems that require custom digital processing or control state machines
- Data buffering and transformation between multiple peripherals or external interfaces using the available I/O and on-chip RAM
- Reconfigurable interface and control logic in equipment where fixed-function logic may need to be changed during development
Design & Procurement Notes
Design and procurement planning should consider the 0.97 V to 1.03 V supply range, the 676-FCBGA (27 x 27) surface-mount package, and the 400 I/O count when defining power distribution, PCB layout, and interface resources. The 29,306,880 total RAM bits and 406,720 logic elements/cells provide a basis for estimating on-chip buffering and logic capacity. Because the operating temperature is specified as -40°C to 100°C (TJ), thermal analysis should focus on junction temperature under the expected workload and board cooling conditions.
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