XC7K325T-L2FBG676E

Product Overview

The AMD XC7K325T-L2FBG676E is a Kintex-7 field programmable gate array in a 676-BBGA, FCBGA package, with a 676-FCBGA (27x27) package size and surface-mount mounting. It provides 400 I/O, 326,080 logic elements or cells, 25,475 LABs/CLBs, and 16,404,480 total RAM bits. The device operates from a 0.97 V to 1.03 V supply and has an operating temperature range of 0°C to 100°C (TJ).

Key Features

• Kintex-7 FPGA architecture with 326,080 logic elements or cells and 25,475 LABs/CLBs.
• 16,404,480 total RAM bits for on-chip storage and data buffering.
• 400 I/O resources for interfacing with external circuitry.
• Surface-mount 676-BBGA, FCBGA package with 676-FCBGA (27x27) package size.
• 0.97 V to 1.03 V supply voltage range.
• Operating temperature range of 0°C to 100°C (TJ).

Applications

• Custom digital logic control within system-level designs.
• On-chip data buffering using available RAM resources.
• I/O expansion and interface bridging between external circuitry and internal logic.
• Implementation of configurable processing or control blocks in digital logic designs.

Design & Procurement Notes

Designers should verify that the 0.97 V to 1.03 V supply range is met by the system power rail and that thermal management keeps the junction temperature within 0°C to 100°C. The 676-FCBGA (27x27) package and surface-mount construction require compatible PCB land patterns and mounting layout. The 400 I/O count, 326,080 logic elements or cells, 25,475 LABs/CLBs, and 16,404,480 RAM bits should be compared against the required pin assignments, logic utilization, and on-chip memory usage before finalizing the design.