XC7K410T-L2FFG676I
IC FPGA 400 I/O 676FCBGA
Quick Answer: The XC7K410T-L2FFG676I from AMD is a Kintex®-7 field programmable gate array (FPGA) in a 676-ball surface-mount package.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 676-BBGA, FCBGA
- Stock
- 1,479 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 676-FCBGA (27x27) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K410T-L2FFG676I.
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Detailed Description for XC7K410T-L2FFG676I
Product Overview
The XC7K410T-L2FFG676I from AMD is a Kintex®-7 field programmable gate array (FPGA) in a 676-ball surface-mount package. The device includes 400 I/O pins, 406,720 logic elements or cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits. The supply voltage range is 0.97 V ~ 1.03 V, and the operating temperature range is -40°C ~ 100°C (TJ). The package/case designation is 676-BBGA, FCBGA, and the device package is 676-FCBGA (27x27).
Key Features
- Kintex®-7 FPGA architecture with 406,720 logic elements or cells and 31,775 LABs/CLBs.
- Includes 29,306,880 total RAM bits for on-device memory resources.
- Offers 400 I/O pins for external device connectivity.
- Uses a 0.97 V ~ 1.03 V supply voltage.
- Rated for junction temperature operation from -40°C ~ 100°C (TJ).
- Surface-mount 676-BBGA, FCBGA package; device package 676-FCBGA (27x27).
Applications
- Embedded control logic for systems that need reconfigurable digital functions.
- Programmable interface and glue logic between digital subsystems.
- Reconfigurable digital processing subsystems using FPGA logic and internal RAM resources.
Design & Procurement Notes
Designers should confirm the board land pattern, assembly process, and thermal management for the 676-FCBGA (27x27) surface-mount package. The exact part number and package designation should be used during schematic, layout, and assembly data preparation. The 0.97 V ~ 1.03 V supply range requires power delivery and decoupling suitable for the specified voltage limits. The -40°C ~ 100°C (TJ) range should be compared against system ambient conditions and the expected junction temperature. The 400 I/O pins, 406,720 logic elements or cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits should be checked against the required pin count, logic utilization, and on-device memory needs.
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