XC7K410T-1FFG676C
IC FPGA 400 I/O 676FCBGA
Quick Answer: The AMD XC7K410T-1FFG676C is a Kintex®-7 field-programmable gate array (FPGA) for configurable digital logic in embedded designs.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 676-BBGA, FCBGA
- Stock
- 1,450 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 676-FCBGA (27x27) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K410T-1FFG676C.
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Detailed Description for XC7K410T-1FFG676C
Product Overview
The AMD XC7K410T-1FFG676C is a Kintex®-7 field-programmable gate array (FPGA) for configurable digital logic in embedded designs. It combines programmable logic, on-device RAM, and 400 I/O in a surface-mount 676-FCBGA (27 x 27) package. The device provides 406,720 logic elements/cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits. Its supply voltage range is 0.97 V to 1.03 V, and its specified operating temperature range is 0°C to 85°C junction temperature.
Key Features
- Kintex®-7 FPGA architecture
- 406,720 logic elements/cells
- 31,775 LABs/CLBs
- 29,306,880 total RAM bits
- 400 I/O
- 0.97 V to 1.03 V supply voltage
- 0°C to 85°C operating temperature (TJ)
- 676-BBGA, FCBGA package/case
- 676-FCBGA (27 x 27) device package
- Surface-mount mounting type
Applications
- Embedded control and sequencing logic
- Data capture, buffering, and preprocessing
- Bridging between multiple digital interfaces
- Custom digital processing pipelines
- Programmable glue logic and peripheral interface adaptation
Design & Procurement Notes
When selecting this part, verify that the board power architecture can provide the 0.97 V to 1.03 V supply and that thermal design accounts for operation up to 85°C junction temperature. The 400 I/O and 676-FCBGA (27 x 27) package require sufficient fanout, routing, and pad layout for a surface-mount assembly. The 406,720 logic cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits should be mapped against the planned logic, buffering, and interface requirements before finalizing the design. Because the package is a 676-BBGA, FCBGA surface-mount package, consider assembly, rework, and inspection practices appropriate for this package type.
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