XC7K410T-1FBG900C
IC FPGA 500 I/O 900FCBGA
Quick Answer: The XC7K410T-1FBG900C is an AMD Kintex®-7 field programmable gate array (FPGA) supplied as an active component.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 900-BBGA, FCBGA
- Stock
- 1,496 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 900-FCBGA (31x31) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K410T-1FBG900C.
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Detailed Description for XC7K410T-1FBG900C
Product Overview
The XC7K410T-1FBG900C is an AMD Kintex®-7 field programmable gate array (FPGA) supplied as an active component. It is packaged in a 900-BBGA, FCBGA package, with a supplier device package of 900-FCBGA (31x31), and is intended for surface-mount assembly. The device provides 500 I/O, 406720 logic elements/cells, 31775 LABs/CLBs, and 29306880 total RAM bits. Its supply voltage range is 0.97V ~ 1.03V, and its operating temperature range is 0°C ~ 85°C (TJ).
Key Features
- Kintex®-7 FPGA family designation, with manufacturer part number XC7K410T-1FBG900C.
- Provides 406720 logic elements/cells and 31775 LABs/CLBs for programmable digital logic implementation.
- Includes 29306880 total RAM bits and 500 I/O as supplied technical specifications.
- Uses a 900-BBGA, FCBGA package with supplier device package 900-FCBGA (31x31) and surface-mount mounting.
- Operating conditions include 0.97V ~ 1.03V supply voltage and 0°C ~ 85°C (TJ) temperature range.
Applications
- Programmable digital control systems requiring custom logic behavior.
- Data buffering and custom logic processing using 29306880 total RAM bits.
- Hardware prototyping and evaluation platforms using a surface-mount package.
Design & Procurement Notes
When selecting the XC7K410T-1FBG900C, verify that the board layout supports the 900-BBGA, FCBGA package and the 900-FCBGA (31x31) supplier device package, including surface-mount assembly requirements. Confirm that the power system can provide the 0.97V ~ 1.03V supply range and that thermal design maintains junction temperature within 0°C ~ 85°C. Also verify that the design requires 500 I/O, 406720 logic elements/cells, 31775 LABs/CLBs, and 29306880 total RAM bits, and that the supplied lifecycle status is Active.
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