XC7K410T-1FBG676I

Product Overview

The XC7K410T-1FBG676I from AMD is a Kintex-7 field programmable gate array (FPGA) in a 676-BBGA, FCBGA surface-mount package. The device provides 400 I/O, 406,720 logic elements/cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits. It operates from a 0.97 V to 1.03 V supply and is specified for a junction temperature range of -40°C to 100°C (TJ). The 400 I/O and 676-FCBGA (27 x 27) package support programmable logic, data buffering, and interface control tasks in embedded systems.

Key Features

• AMD Kintex-7 FPGA architecture
• 400 I/O for configurable external interfacing
• 406,720 logic elements/cells
• 31,775 LABs/CLBs
• 29,306,880 total RAM bits
• 0.97 V to 1.03 V supply voltage
• Surface-mount 676-BBGA, FCBGA package
• 676-FCBGA (27 x 27) device package
• -40°C to 100°C (TJ) operating temperature

Applications

• Programmable logic in embedded systems that require custom digital processing or control state machines
• Data buffering and transformation between multiple peripherals or external interfaces using the available I/O and on-chip RAM
• Reconfigurable interface and control logic in equipment where fixed-function logic may need to be changed during development

Design & Procurement Notes

Design and procurement planning should consider the 0.97 V to 1.03 V supply range, the 676-FCBGA (27 x 27) surface-mount package, and the 400 I/O count when defining power distribution, PCB layout, and interface resources. The 29,306,880 total RAM bits and 406,720 logic elements/cells provide a basis for estimating on-chip buffering and logic capacity. Because the operating temperature is specified as -40°C to 100°C (TJ), thermal analysis should focus on junction temperature under the expected workload and board cooling conditions.