XC7K325T-1FFG676I
IC FPGA 400 I/O 676FCBGA
Quick Answer: The AMD XC7K325T-1FFG676I is a Kintex-7 field programmable gate array in a 676-BBGA, FCBGA package, with a 676-FCBGA (27x27) package variant.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 676-BBGA, FCBGA
- Stock
- 1,460 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 676-FCBGA (27x27) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K325T-1FFG676I.
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Detailed Description for XC7K325T-1FFG676I
Product Overview
The AMD XC7K325T-1FFG676I is a Kintex-7 field programmable gate array in a 676-BBGA, FCBGA package, with a 676-FCBGA (27x27) package variant. It is a surface-mount FPGA offering 400 I/O, 326080 logic elements/cells, 25475 LABs/CLBs, and 16404480 total RAM bits. The device has a supply voltage range of 0.97V to 1.03V and an operating temperature range of -40°C to 100°C (TJ). The architecture supports custom digital logic and interface design within a single programmable device.
Key Features
- Kintex-7 FPGA architecture with 326080 logic elements/cells and 25475 LABs/CLBs.
- 400 I/O for custom peripheral, interface, and signal routing designs.
- 16404480 total RAM bits for on-chip data buffering and processing.
- Surface-mount 676-BBGA, FCBGA package with 676-FCBGA (27x27) package variant.
- Supply voltage range of 0.97V to 1.03V.
- Operating temperature range of -40°C to 100°C (TJ).
Applications
- Programmable logic in embedded control systems requiring custom digital functions.
- High-I/O sensor, peripheral, or signal interfacing within FPGA-based boards.
- Data buffering and processing using available on-chip RAM resources.
- Protocol adaptation, signal routing, or logic reconfiguration in programmable hardware designs.
Design & Procurement Notes
Design planning should account for the 676-BBGA, FCBGA package and 676-FCBGA (27x27) footprint, including surface-mount land patterns, power delivery, and thermal management for the -40°C to 100°C (TJ) operating temperature range. The 0.97V to 1.03V supply requirement should be reflected in the power tree and decoupling strategy. With 400 I/O, 326080 logic elements/cells, 25475 LABs/CLBs, and 16404480 total RAM bits, designers can allocate resources for custom logic, interface fan-out, and on-chip data handling. Use the exact manufacturer part number XC7K325T-1FFG676I in documentation for traceability and configuration control.
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