XC7K160T-1FBG484I
IC FPGA 285 I/O 484FCBGA
Quick Answer: The XC7K160T-1FBG484I from AMD is a Kintex®-7 field programmable gate array (FPGA) intended for embedded logic design where programmable resources are required.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 484-BBGA, FCBGA
- Stock
- 1,450 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 484-FCBGA (23x23) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K160T-1FBG484I.
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Detailed Description for XC7K160T-1FBG484I
Product Overview
The XC7K160T-1FBG484I from AMD is a Kintex®-7 field programmable gate array (FPGA) intended for embedded logic design where programmable resources are required. This surface-mount device provides 162240 logic elements/cells, 12675 LABs/CLBs, and 11980800 total RAM bits, supporting substantial on-chip logic and memory capacity. It uses a 484-FCBGA (23x23) package with 285 I/O, and operates from a 0.97V ~ 1.03V supply over a junction temperature range of -40°C ~ 100°C. The architecture is suitable for designs that need configurable digital logic, interface control, and memory-based processing within a single programmable device.
Key Features
- Kintex®-7 FPGA architecture from AMD
- 162240 logic elements/cells and 12675 LABs/CLBs
- 11980800 total RAM bits
- 285 I/O in a 484-FCBGA (23x23) surface-mount package
- 0.97V ~ 1.03V supply voltage
- -40°C ~ 100°C (TJ) operating temperature range
Applications
- Embedded control logic in programmable system designs
- Digital signal processing and data-path subsystems
- Protocol bridging and interface adaptation between digital components
- Memory-intensive logic functions in reconfigurable hardware platforms
Design & Procurement Notes
Design teams should confirm that the board power delivery network can maintain the 0.97V ~ 1.03V supply range across expected load and temperature conditions. The 484-FCBGA (23x23) surface-mount package and 285 I/O require careful fanout, routing, and thermal planning, particularly when operating near the -40°C ~ 100°C (TJ) junction temperature limits. The available 162240 logic elements/cells, 12675 LABs/CLBs, and 11980800 total RAM bits should be mapped against the planned logic and memory usage before finalizing the architecture. For procurement, specify the exact part number XC7K160T-1FBG484I and the 484-FCBGA (23x23) package to ensure the intended mounting type and footprint are used.
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