XC7K355T-1FFG901C
IC FPGA 300 I/O 901FCBGA
Quick Answer: The XC7K355T-1FFG901C from AMD is a Kintex-7 field-programmable gate array integrated circuit intended for surface-mount designs.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 900-BBGA, FCBGA
- Stock
- 1,456 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Kintex®-7 |
| Supplier Device Package | 901-FCBGA (31x31) |
| Voltage - Supply | 0.97V ~ 1.03V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XC7K355T-1FFG901C.
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Detailed Description for XC7K355T-1FFG901C
Product Overview
The XC7K355T-1FFG901C from AMD is a Kintex-7 field-programmable gate array integrated circuit intended for surface-mount designs. It provides 300 I/O pins, 356,160 logic elements/cells, 27,825 LABs/CLBs, and 26,357,760 total RAM bits. The device has a supply voltage range of 0.97 V to 1.03 V and an operating junction temperature range of 0°C to 85°C. The device package is 901-FCBGA (31x31), with a 900-BBGA, FCBGA case. This configuration supports configurable digital logic and on-chip memory functions in board-level designs.
Key Features
- Kintex-7 FPGA architecture with 356,160 logic elements/cells and 27,825 LABs/CLBs.
- 26,357,760 total RAM bits for on-chip memory functions.
- 300 I/O pins for external interface connections.
- Supply voltage range of 0.97 V to 1.03 V.
- Operating junction temperature range of 0°C to 85°C.
- 901-FCBGA (31x31) package, with a 900-BBGA, FCBGA case.
- Surface-mount device with AMD Kintex-7 series designation.
Applications
- Configurable control logic in digital systems.
- Interface aggregation across multiple external signals using 300 I/O pins.
- On-chip data storage or buffering within digital processing paths.
- Board-level programmable logic implementation using a Kintex-7 device.
Design & Procurement Notes
Design teams should account for the 0.97 V to 1.03 V supply range, the 0°C to 85°C junction temperature limit, and the 901-FCBGA (31x31) surface-mount package when planning power delivery, thermal management, and PCB layout. The 300 I/O pins, 356,160 logic elements/cells, 27,825 LABs/CLBs, and 26,357,760 total RAM bits define the available logic, I/O, and memory resources for the target architecture. The 900-BBGA, FCBGA case and 31x31 package designation should be matched to the appropriate land pattern and assembly process.
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