XC7K410T-L2FFG676I

Product Overview

The XC7K410T-L2FFG676I from AMD is a Kintex®-7 field programmable gate array (FPGA) in a 676-ball surface-mount package. The device includes 400 I/O pins, 406,720 logic elements or cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits. The supply voltage range is 0.97 V ~ 1.03 V, and the operating temperature range is -40°C ~ 100°C (TJ). The package/case designation is 676-BBGA, FCBGA, and the device package is 676-FCBGA (27x27).

Key Features

• Kintex®-7 FPGA architecture with 406,720 logic elements or cells and 31,775 LABs/CLBs.
• Includes 29,306,880 total RAM bits for on-device memory resources.
• Offers 400 I/O pins for external device connectivity.
• Uses a 0.97 V ~ 1.03 V supply voltage.
• Rated for junction temperature operation from -40°C ~ 100°C (TJ).
• Surface-mount 676-BBGA, FCBGA package; device package 676-FCBGA (27x27).

Applications

• Embedded control logic for systems that need reconfigurable digital functions.
• Programmable interface and glue logic between digital subsystems.
• Reconfigurable digital processing subsystems using FPGA logic and internal RAM resources.

Design & Procurement Notes

Designers should confirm the board land pattern, assembly process, and thermal management for the 676-FCBGA (27x27) surface-mount package. The exact part number and package designation should be used during schematic, layout, and assembly data preparation. The 0.97 V ~ 1.03 V supply range requires power delivery and decoupling suitable for the specified voltage limits. The -40°C ~ 100°C (TJ) range should be compared against system ambient conditions and the expected junction temperature. The 400 I/O pins, 406,720 logic elements or cells, 31,775 LABs/CLBs, and 29,306,880 total RAM bits should be checked against the required pin count, logic utilization, and on-device memory needs.