LFE5UM5G-85F-8BG381C
IC FPGA 205 I/O 381CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 381-FBGA
- 庫存
- 1,444 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP5-5G |
| Supplier Device Package | 381-CABGA (17x17) |
| Voltage - Supply | 1.045V ~ 1.155V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE5UM5G-85F-8BG381C 的主要供貨及採購資訊。
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LFE5UM5G-85F-8BG381C 詳細描述
Product Overview
The LFE5UM5G-85F-8BG381C from Lattice Semiconductor Corporation is an ECP5-5G field programmable gate array intended for embedded programmable logic designs. It is supplied in a surface-mount 381-FBGA package, also identified as 381-CABGA (17x17). The device provides 205 I/O, 84,000 logic elements/cells, 21,000 LABs/CLBs, and 3,833,856 total RAM bits. Its specified supply voltage range is 1.045 V to 1.155 V, and its operating temperature range is 0°C to 85°C (TJ). This part is suited to board-level implementations where programmable digital logic, I/O control, and on-chip memory resources need to be integrated into a compact BGA footprint.
Key Features
- ECP5-5G field programmable gate array from Lattice Semiconductor Corporation.
- 381-FBGA surface-mount package, identified as 381-CABGA (17x17).
- 84,000 logic elements/cells and 21,000 LABs/CLBs.
- 3,833,856 total RAM bits.
- 205 I/O.
- Supply voltage range of 1.045 V to 1.155 V.
- Operating temperature range of 0°C to 85°C (TJ).
Applications
- Embedded control logic in programmable digital systems.
- Sensor and actuator interface aggregation using available I/O.
- Data buffering and state-machine implementation using on-chip RAM and logic resources.
- I/O expansion and glue logic replacement in board-level designs.
- Programmable timing and control functions in compact BGA-based embedded hardware.
Design & Procurement Notes
Design teams should plan the core supply within the specified 1.045 V to 1.155 V range and provide stable decoupling for the 381-CABGA (17x17) BGA footprint. PCB layout, via fan-out, solder paste, reflow profile, and inspection should account for the surface-mount package and 205 I/O signal routing. Thermal design should keep junction temperature within 0°C to 85°C under expected operating conditions. Resource planning should consider the 84,000 logic elements/cells, 21,000 LABs/CLBs, and 3,833,856 total RAM bits when defining logic, buffering, and I/O partitioning.
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