料號

LFE5U-85F-7BG554C

IC FPGA 259 I/O 554CABGA

封裝
554-FBGA
庫存
1,452 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series ECP5
Supplier Device Package 554-CABGA (23x23)
Voltage - Supply 1.045V ~ 1.155V
資料表 查看資料表PDF
採購資訊

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料號 LFE5U-85F-7BG554C
供貨狀態 列示庫存 1,452 pcs 當前數量需確認。
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LFE5U-85F-7BG554C 詳細描述

Product Overview

The LFE5U-85F-7BG554C is an ECP5 field programmable gate array from Lattice Semiconductor Corporation. It provides programmable logic, on-chip RAM, and 259 I/O in a surface-mount 554-CABGA (23x23) package. The device operates from a 1.045V to 1.155V supply and is specified for a junction temperature range of 0°C to 85°C, for embedded logic, interface adaptation, and data buffering designs.

Key Features

  • 84000 logic elements/cells and 21000 LABs/CLBs provide programmable logic capacity for embedded digital designs.
  • 3,833,856 total RAM bits support on-chip data buffering and temporary storage.
  • 259 I/O channels provide external digital device connectivity.
  • 1.045V to 1.155V supply range defines the operating supply limits.
  • 0°C to 85°C (TJ) operating range guides thermal design for junction temperature control.
  • 554-CABGA (23x23) surface-mount package and 554-FBGA case define the PCB footprint.

Applications

  • Embedded control logic and state machines in programmable hardware designs.
  • Interface bridging between digital peripherals and programmable logic using available I/O resources.
  • On-chip data buffering and temporary storage supported by the available RAM bits.
  • Programmable signal routing and glue logic for board-level integration.

Design & Procurement Notes

Designers should confirm that the required logic capacity, I/O count, and RAM bits fit the 84000 logic elements/cells, 259 I/O, and 3,833,856 total RAM bits available in this ECP5 device. The 1.045V to 1.155V supply range requires regulated power delivery within those limits, and the 0°C to 85°C (TJ) rating should be evaluated using junction temperature rather than ambient temperature alone. PCB layout should match the 554-CABGA (23x23) surface-mount footprint and 554-FBGA package, with attention to thermal dissipation and signal integrity for the 259 I/O channels.

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