LFE5U-85F-7BG554C
IC FPGA 259 I/O 554CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 554-FBGA
- 庫存
- 1,452 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP5 |
| Supplier Device Package | 554-CABGA (23x23) |
| Voltage - Supply | 1.045V ~ 1.155V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE5U-85F-7BG554C 的主要供貨及採購資訊。
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LFE5U-85F-7BG554C 詳細描述
Product Overview
The LFE5U-85F-7BG554C is an ECP5 field programmable gate array from Lattice Semiconductor Corporation. It provides programmable logic, on-chip RAM, and 259 I/O in a surface-mount 554-CABGA (23x23) package. The device operates from a 1.045V to 1.155V supply and is specified for a junction temperature range of 0°C to 85°C, for embedded logic, interface adaptation, and data buffering designs.
Key Features
- 84000 logic elements/cells and 21000 LABs/CLBs provide programmable logic capacity for embedded digital designs.
- 3,833,856 total RAM bits support on-chip data buffering and temporary storage.
- 259 I/O channels provide external digital device connectivity.
- 1.045V to 1.155V supply range defines the operating supply limits.
- 0°C to 85°C (TJ) operating range guides thermal design for junction temperature control.
- 554-CABGA (23x23) surface-mount package and 554-FBGA case define the PCB footprint.
Applications
- Embedded control logic and state machines in programmable hardware designs.
- Interface bridging between digital peripherals and programmable logic using available I/O resources.
- On-chip data buffering and temporary storage supported by the available RAM bits.
- Programmable signal routing and glue logic for board-level integration.
Design & Procurement Notes
Designers should confirm that the required logic capacity, I/O count, and RAM bits fit the 84000 logic elements/cells, 259 I/O, and 3,833,856 total RAM bits available in this ECP5 device. The 1.045V to 1.155V supply range requires regulated power delivery within those limits, and the 0°C to 85°C (TJ) rating should be evaluated using junction temperature rather than ambient temperature alone. PCB layout should match the 554-CABGA (23x23) surface-mount footprint and 554-FBGA package, with attention to thermal dissipation and signal integrity for the 259 I/O channels.
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