LFE5U-12F-8BG256I
IC FPGA 197 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,481 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP5 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.045V ~ 1.155V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE5U-12F-8BG256I 的主要供貨及採購資訊。
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LFE5U-12F-8BG256I 詳細描述
Product Overview
The LFE5U-12F-8BG256I is an ECP5 series field programmable gate array from Lattice Semiconductor Corporation. It provides 12,000 logic elements/cells and 3,000 LABs/CLBs, with 589,824 total RAM bits and 197 I/O. The device uses a surface-mount 256-LFBGA package, designated 256-CABGA (14x14), and operates from a 1.045V to 1.155V supply over a junction temperature range of -40°C to 100°C. This embedded FPGA supports configurable digital logic within system designs.
Key Features
- 12,000 logic elements/cells and 3,000 LABs/CLBs for programmable digital logic.
- 589,824 total RAM bits.
- 197 I/O pins for system connectivity.
- 1.045V to 1.155V supply voltage range.
- Surface-mount 256-LFBGA package, 256-CABGA (14x14), with -40°C to 100°C operating junction temperature.
- ECP5 series FPGA with a 256-CABGA (14x14) package footprint.
Applications
- Embedded logic integration in control and communication subsystems.
- Programmable interface bridging between processors, peripherals, and custom digital blocks.
- Reconfigurable digital processing paths in embedded designs.
- Hardware prototyping of custom digital logic.
Design & Procurement Notes
Design considerations should account for the 1.045V to 1.155V supply range, the 197 I/O pinout, and the on-chip resources of 12,000 logic elements/cells, 3,000 LABs/CLBs, and 589,824 RAM bits. The 256-LFBGA / 256-CABGA (14x14) surface-mount package requires an appropriate PCB land pattern and thermal design for operation from -40°C to 100°C junction temperature. The 14x14 package designation should be checked against the final PCB land pattern and connector placement. These constraints help determine power delivery, board routing, and logic or memory budgeting for the target system.
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