LFE5UM-45F-6BG554I
IC FPGA 245 I/O 554CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 554-FBGA
- 庫存
- 1,429 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP5 |
| Supplier Device Package | 554-CABGA (23x23) |
| Voltage - Supply | 1.045V ~ 1.155V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE5UM-45F-6BG554I 的主要供貨及採購資訊。
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LFE5UM-45F-6BG554I 詳細描述
Product Overview
The LFE5UM-45F-6BG554I from Lattice Semiconductor Corporation is an ECP5 field programmable gate array (FPGA) intended for embedded logic design. It provides 44,000 logic elements/cells, 11,000 LABs/CLBs, 1,990,656 total RAM bits, and 245 I/O in a 554-FBGA package. The device is surface mount and operates with a 1.045 V to 1.155 V supply over a junction temperature range of -40°C to 100°C. The 554-CABGA (23x23) package supports compact board layouts where programmable logic, memory resources, and I/O connectivity are required.
Key Features
- 44,000 logic elements/cells and 11,000 LABs/CLBs define the programmable logic capacity of this ECP5 FPGA.
- 1,990,656 total RAM bits provide on-chip memory for FPGA-based designs.
- 245 I/O pins provide external connectivity for embedded logic designs.
- 1.045 V to 1.155 V supply range defines the voltage operating window for board power design.
- 554-FBGA and 554-CABGA (23x23) surface-mount package supports compact board layouts.
- Operating junction temperature range of -40°C to 100°C defines the thermal envelope for use.
Applications
- Embedded logic control in systems that require reconfigurable digital functions.
- Data buffering and aggregation using the FPGA's logic and RAM resources.
- Interface bridging between multiple I/O-connected subsystems in compact embedded boards.
- Sensor or peripheral signal processing where programmable logic and on-chip memory are needed.
- Programmable logic replacement for fixed-function circuitry in embedded hardware.
Design & Procurement Notes
Designers selecting the LFE5UM-45F-6BG554I should plan for a 1.045 V to 1.155 V supply and a surface-mount 554-FBGA footprint with a 554-CABGA (23x23) package. The thermal design should account for operation from -40°C to 100°C junction temperature. Board layout should consider the 245 I/O count, 44,000 logic elements/cells, 11,000 LABs/CLBs, and 1,990,656 total RAM bits when allocating logic and memory resources. Because the device is an ECP5 FPGA, designers should confirm that these logic, RAM, I/O, voltage, temperature, and package specifications match the requirements of the target embedded design.
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