LFE5UM-85F-8BG756C
IC FPGA 365 I/O 756CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 756-FBGA
- 庫存
- 1,425 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP5 |
| Supplier Device Package | 756-CABGA (27x27) |
| Voltage - Supply | 1.045V ~ 1.155V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE5UM-85F-8BG756C 的主要供貨及採購資訊。
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LFE5UM-85F-8BG756C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LFE5UM-85F-8BG756C is an ECP5 field programmable gate array (FPGA) for embedded logic applications. It provides 84,000 logic elements or cells, 21,000 LABs/CLBs, and 3,833,856 total RAM bits, along with 365 I/O pins for external device connection. The device operates from a 1.045 V to 1.155 V supply and is specified for a junction temperature range of 0°C to 85°C. It uses a 756-FBGA surface-mount package, with a 756-CABGA (27 x 27) package footprint.
Key Features
- ECP5 FPGA series
- 84,000 logic elements or cells
- 21,000 LABs/CLBs
- 3,833,856 total RAM bits
- 365 I/O pins
- 1.045 V to 1.155 V supply voltage
- 0°C to 85°C (TJ) operating temperature range
- 756-FBGA surface-mount package
- 756-CABGA (27 x 27) package footprint
Applications
- Embedded control logic where custom combinational and sequential functions replace discrete logic
- Data buffering and aggregation between external devices using on-chip RAM resources
- I/O expansion and signal routing in systems requiring multiple I/O pins
- Programmable digital processing blocks for embedded hardware subsystems
Design & Procurement Notes
For board design, consider the 1.045 V to 1.155 V supply range when planning regulated power delivery. The 756-CABGA (27 x 27) surface-mount package influences PCB land pattern, routing density, soldering process, and inspection or rework access. The 365 I/O count should be mapped early against connector and routing requirements. The 84,000 logic elements, 21,000 LABs/CLBs, and 3,833,856 total RAM bits define the available logic and memory budget, while the 0°C to 85°C (TJ) range requires junction temperature monitoring and adequate thermal design.
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