LFE5U-12F-7BG256C
IC FPGA 197 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,429 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP5 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.045V ~ 1.155V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE5U-12F-7BG256C 的主要供貨及採購資訊。
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LFE5U-12F-7BG256C 詳細描述
Product Overview
The LFE5U-12F-7BG256C from Lattice Semiconductor Corporation is an ECP5 field programmable gate array (FPGA) for embedded logic and programmable interconnect tasks. It provides 12,000 logic elements/cells, 3,000 LABs/CLBs, 589,824 total RAM bits, and 197 I/O. The device is surface mount and is offered in a 256-LFBGA package, with a 256-CABGA (14 x 14) package. Its specified supply voltage range is 1.045 V to 1.155 V, and its operating temperature range is 0°C to 85°C (TJ).
Key Features
- ECP5 FPGA architecture with 12,000 logic elements/cells and 3,000 LABs/CLBs.
- 589,824 total RAM bits for on-device memory and buffering.
- 197 I/O for embedded logic interfacing and programmable connectivity.
- Surface-mount 256-LFBGA package; 256-CABGA (14 x 14) package.
- Specified supply voltage range of 1.045 V to 1.155 V.
- Operating temperature range of 0°C to 85°C (TJ).
Applications
- Embedded control logic and programmable state-machine implementation.
- Board-level interface bridging and custom glue logic.
- On-device buffering and data-path logic using the device RAM bits.
- Surface-mount programmable hardware development for embedded systems.
Design & Procurement Notes
When selecting this part, verify that the board power architecture can provide the specified 1.045 V to 1.155 V supply and that thermal design keeps the junction temperature within 0°C to 85°C. The 197 I/O count should be mapped against required external connections, while the 12,000 logic elements/cells, 3,000 LABs/CLBs, and 589,824 RAM bits should be checked against the target design's logic and buffering requirements. The surface-mount 256-LFBGA package, also identified as 256-CABGA (14 x 14), requires compatible PCB footprint, assembly process, and thermal management.
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