PART NUMBER

LFE5UM-85F-8BG756C

IC FPGA 365 I/O 756CABGA

Quick Answer: The Lattice Semiconductor Corporation LFE5UM-85F-8BG756C is an ECP5 field programmable gate array (FPGA) for embedded logic applications.

Package
756-FBGA
Stock
1,425 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Lattice Semiconductor Corporation
Product Category FPGA - Field Programmable Gate Array
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series ECP5
Supplier Device Package 756-CABGA (27x27)
Voltage - Supply 1.045V ~ 1.155V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for LFE5UM-85F-8BG756C.

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Part Number LFE5UM-85F-8BG756C
Availability 1,425 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for LFE5UM-85F-8BG756C

Product Overview

The Lattice Semiconductor Corporation LFE5UM-85F-8BG756C is an ECP5 field programmable gate array (FPGA) for embedded logic applications. It provides 84,000 logic elements or cells, 21,000 LABs/CLBs, and 3,833,856 total RAM bits, along with 365 I/O pins for external device connection. The device operates from a 1.045 V to 1.155 V supply and is specified for a junction temperature range of 0°C to 85°C. It uses a 756-FBGA surface-mount package, with a 756-CABGA (27 x 27) package footprint.

Key Features

  • ECP5 FPGA series
  • 84,000 logic elements or cells
  • 21,000 LABs/CLBs
  • 3,833,856 total RAM bits
  • 365 I/O pins
  • 1.045 V to 1.155 V supply voltage
  • 0°C to 85°C (TJ) operating temperature range
  • 756-FBGA surface-mount package
  • 756-CABGA (27 x 27) package footprint

Applications

  • Embedded control logic where custom combinational and sequential functions replace discrete logic
  • Data buffering and aggregation between external devices using on-chip RAM resources
  • I/O expansion and signal routing in systems requiring multiple I/O pins
  • Programmable digital processing blocks for embedded hardware subsystems

Design & Procurement Notes

For board design, consider the 1.045 V to 1.155 V supply range when planning regulated power delivery. The 756-CABGA (27 x 27) surface-mount package influences PCB land pattern, routing density, soldering process, and inspection or rework access. The 365 I/O count should be mapped early against connector and routing requirements. The 84,000 logic elements, 21,000 LABs/CLBs, and 3,833,856 total RAM bits define the available logic and memory budget, while the 0°C to 85°C (TJ) range requires junction temperature monitoring and adequate thermal design.

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