PART NUMBER

XC7K325T-3FFG676C

High-performance Kintex-7 FPGA with 326K logic cells, 676-FCBGA package for advanced designs

Quick Answer: XC7K325T-3FFG676C is an AMD Xilinx Kintex-7 Field Programmable Gate Array (FPGA) designed for high-performance, low-power programmable logic applications.

Manufacturer
AMD
Product Category
FPGA Configuration PROMs
Package
BGA
Stock
1,500 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer AMD
Product Category FPGA Configuration PROMs
Applications Industrial Control, Networking, Video Processing, Communications
Block RAM 16,020 Kbit
Device Family XC7K325T
Distributed RAM 4,000 Kbit
DSP Slices 840
Flip-Flops 407,600
I/O Pins 500
Logic Cells 326,080
Lookup Tables (LUTs) 203,800
Maximum Data Rate Up to 12.5 Gb/s per GTX Transceiver
Mounting Type Surface Mount Technology (SMT)
Operating Temperature Range 0°C to +100°C
Operating Voltage 1.0V / 1.8V / 3.3V
Package FCBGA-676
Package Size 27 mm × 27 mm
Process Technology 28 nm High-K Metal Gate
Series Kintex-7
Speed Grade -3 (High Performance)
Total RAM 16,044,480 Bits
Transceivers 16 GTX Transceivers
Datasheet Request Datasheet
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for XC7K325T-3FFG676C.

Check Price & Availability
Part Number XC7K325T-3FFG676C
Availability 1,500 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
SOURCING CAPABILITIES

Why Source from Antrex Electronics?

Independent distribution support for verified sourcing, inspection and international procurement requirements.

Independent Distribution Support

Shortage, obsolete and hard-to-find component sourcing for production and procurement requirements.

Traceability Review

Label, lot, date code and available supply-chain documentation can be reviewed before order confirmation.

Inspection & Testing

Visual inspection, X-ray and third-party testing support can be arranged when required.

Global Procurement Support

Support for OEM, EMS, distributors and international sourcing requirements across individual parts and BOM projects.

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Quality controls, traceability review and inspection support for electronic component sourcing.

ISO 9001 SGS
ISO 9001 Quality management
ESD Control
ESD Control Component handling
ERAI Membership
ERAI Industry sourcing support
Component Traceability
Traceability Label, lot & documentation review
Testing Support
Testing Support X-ray & third-party testing

Detailed Description for XC7K325T-3FFG676C

Product Overview

XC7K325T-3FFG676C is an AMD Xilinx Kintex-7 Field Programmable Gate Array (FPGA) designed for high-performance, low-power programmable logic applications. Built on 28nm high-k metal gate process technology, this device integrates 326,080 logic cells, 16.02 Mbit block RAM, 840 DSP slices and high-speed GTX transceivers. With a -3 speed grade, 676-ball FCBGA package and industrial-grade reliability, XC7K325T-3FFG676C is ideal for advanced communication systems, industrial automation, video processing, embedded computing and high-speed data processing applications. 

Key Features

  • Manufacturer: Xilinx (AMD)

  • Part Number: XC7K325T-3FFG676C

  • Product Type: Field Programmable Gate Array (FPGA)

  • Series: Kintex-7

  • Process Technology: 28nm High-K Metal Gate (HKMG)

  • Device Grade: Commercial Grade

  • Speed Grade: -3 (High Performance Grade)

  • Logic Cells: 326,080 Logic Cells

  • Configurable Logic Blocks (CLBs): 50,950 CLBs

  • Look-Up Tables (LUTs): 203,800 LUTs

  • Flip-Flops: 407,600 Registers

  • DSP Slices: 840 DSP48 Slices

  • Embedded Block RAM: 16,020 Kbits

  • Distributed RAM: Approx. 4,000 Kbits

  • GTX Transceivers: 16 High-Speed Serial Transceivers

  • Transceiver Data Rate: Up to 6.6Gb/s

  • User I/O Count: Up to 500 I/O Pins

  • Core Supply Voltage: 1.0V to 1.2V

  • I/O Voltage Support: 1.2V to 3.3V

  • Package Type: FCBGA-676

  • Mounting Type: Surface Mount Technology (SMT)

  • Operating Temperature Range: 0°C to +85°C

  • Configuration Memory: SRAM-Based FPGA Configuration

  • Integrated Features: PCI Express Endpoint/Root Port, DDR3 memory interface support, MMCM and PLL clock management

  • Features: High logic density, low power consumption, high-speed connectivity and flexible programmable architecture

  • Typical Applications: Wireless communication, industrial control, image processing, medical equipment, aerospace systems and embedded computing platforms

  • Datasheet: XC7K325T-3FFG676C datasheet PDF available for technical verification before production use. 

Applications

XC7K325T-3FFG676C is designed for applications requiring high-performance parallel processing, flexible hardware acceleration and reliable programmable logic resources. Typical applications include communication infrastructure, radar and defense electronics, industrial automation systems, video and image processing equipment, medical imaging devices, network equipment and FPGA-based acceleration platforms. 

Quality & Sourcing

Antrex Electronics can support XC7K325T-3FFG676C sourcing with stock availability checks, RFQ quotation, package confirmation, date code review and shipment arrangement. For project-based purchasing, customers can provide quantity requirements, delivery schedules, application details and technical specifications for faster quotation support.

For quality assurance, Antrex Electronics can assist with product photos, marking verification, visual inspection and third-party testing services when required. OEM manufacturers, industrial automation suppliers, communication equipment companies and electronic component buyers are welcome to submit BOM lists or hard-to-find FPGA requirements for sourcing assistance.

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