XC7K325T-3FFG676C
High-performance Kintex-7 FPGA with 326K logic cells, 676-FCBGA package for advanced designs
- 제조사
- AMD
- 제품 카테고리
- FPGA 구성 PROM
- 패키지
- BGA
- 재고
- 1,500 개
- 공급 가능 여부
- 현재 수량은 확인이 필요합니다.
제품 특성
| 제조사 | AMD |
|---|---|
| 제품 카테고리 | FPGA 구성 PROM |
| Applications | Industrial Control, Networking, Video Processing, Communications |
| Block RAM | 16,020 Kbit |
| Device Family | XC7K325T |
| Distributed RAM | 4,000 Kbit |
| DSP Slices | 840 |
| Flip-Flops | 407,600 |
| I/O Pins | 500 |
| Logic Cells | 326,080 |
| Lookup Tables (LUTs) | 203,800 |
| Maximum Data Rate | Up to 12.5 Gb/s per GTX Transceiver |
| Mounting Type | Surface Mount Technology (SMT) |
| Operating Temperature Range | 0°C to +100°C |
| Operating Voltage | 1.0V / 1.8V / 3.3V |
| Package | FCBGA-676 |
| Package Size | 27 mm × 27 mm |
| Process Technology | 28 nm High-K Metal Gate |
| Series | Kintex-7 |
| Speed Grade | -3 (High Performance) |
| Total RAM | 16,044,480 Bits |
| Transceivers | 16 GTX Transceivers |
| 데이터시트 | 데이터시트 요청 |
조달 개요
XC7K325T-3FFG676C의 주요 공급 및 구매 정보입니다.
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검사 및 테스트
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인증 및 검증 지원
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XC7K325T-3FFG676C 상세 설명
Product Overview
XC7K325T-3FFG676C is an AMD Xilinx Kintex-7 Field Programmable Gate Array (FPGA) designed for high-performance, low-power programmable logic applications. Built on 28nm high-k metal gate process technology, this device integrates 326,080 logic cells, 16.02 Mbit block RAM, 840 DSP slices and high-speed GTX transceivers. With a -3 speed grade, 676-ball FCBGA package and industrial-grade reliability, XC7K325T-3FFG676C is ideal for advanced communication systems, industrial automation, video processing, embedded computing and high-speed data processing applications.
Key Features
Manufacturer: Xilinx (AMD)
Part Number: XC7K325T-3FFG676C
Product Type: Field Programmable Gate Array (FPGA)
Series: Kintex-7
Process Technology: 28nm High-K Metal Gate (HKMG)
Device Grade: Commercial Grade
Speed Grade: -3 (High Performance Grade)
Logic Cells: 326,080 Logic Cells
Configurable Logic Blocks (CLBs): 50,950 CLBs
Look-Up Tables (LUTs): 203,800 LUTs
Flip-Flops: 407,600 Registers
DSP Slices: 840 DSP48 Slices
Embedded Block RAM: 16,020 Kbits
Distributed RAM: Approx. 4,000 Kbits
GTX Transceivers: 16 High-Speed Serial Transceivers
Transceiver Data Rate: Up to 6.6Gb/s
User I/O Count: Up to 500 I/O Pins
Core Supply Voltage: 1.0V to 1.2V
I/O Voltage Support: 1.2V to 3.3V
Package Type: FCBGA-676
Mounting Type: Surface Mount Technology (SMT)
Operating Temperature Range: 0°C to +85°C
Configuration Memory: SRAM-Based FPGA Configuration
Integrated Features: PCI Express Endpoint/Root Port, DDR3 memory interface support, MMCM and PLL clock management
Features: High logic density, low power consumption, high-speed connectivity and flexible programmable architecture
Typical Applications: Wireless communication, industrial control, image processing, medical equipment, aerospace systems and embedded computing platforms
Datasheet: XC7K325T-3FFG676C datasheet PDF available for technical verification before production use.
Applications
XC7K325T-3FFG676C is designed for applications requiring high-performance parallel processing, flexible hardware acceleration and reliable programmable logic resources. Typical applications include communication infrastructure, radar and defense electronics, industrial automation systems, video and image processing equipment, medical imaging devices, network equipment and FPGA-based acceleration platforms.
Quality & Sourcing
Antrex Electronics can support XC7K325T-3FFG676C sourcing with stock availability checks, RFQ quotation, package confirmation, date code review and shipment arrangement. For project-based purchasing, customers can provide quantity requirements, delivery schedules, application details and technical specifications for faster quotation support.
For quality assurance, Antrex Electronics can assist with product photos, marking verification, visual inspection and third-party testing services when required. OEM manufacturers, industrial automation suppliers, communication equipment companies and electronic component buyers are welcome to submit BOM lists or hard-to-find FPGA requirements for sourcing assistance.
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