EFP0111GM20-DR
EFP0111 BOOST BOOTSTRAP PMIC
Quick Answer: EFP0111GM20-DR is a Silicon Labs EFP01 boost bootstrap power management IC intended for industrial automation equipment.
- Manufacturer
- Silicon Labs
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 20-VFQFN Exposed Pad
- Stock
- 2,528 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Silicon Labs |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Industrial Automation |
| Current - Supply | 24nA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Discontinued at Digi-Key |
| Series | EFP01 |
| Supplier Device Package | 20-QFN (3x3) |
| Voltage - Supply | 1.5V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for EFP0111GM20-DR.
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Detailed Description for EFP0111GM20-DR
Product Overview
EFP0111GM20-DR is a Silicon Labs EFP01 boost bootstrap power management IC intended for industrial automation equipment. The device is a specialized PMIC and is packaged in a 20-QFN (3x3) package with an exposed pad for surface-mount assembly. Its supply voltage range is 1.5 V to 5.5 V, with a supply current of 24 nA. The junction temperature range is -40°C to 100°C. The device provides compact power management for industrial control and automation hardware designs.
Key Features
- Boost bootstrap power management function in the EFP01 series.
- Supply voltage range: 1.5 V to 5.5 V.
- Supply current: 24 nA.
- Operating junction temperature range: -40°C to 100°C.
- 20-QFN (3x3) surface-mount package with exposed pad.
Applications
- Industrial control and automation equipment using a compact surface-mount power-management stage.
- Control modules operating from 1.5 V to 5.5 V supply rails.
Design & Procurement Notes
When selecting EFP0111GM20-DR, account for its 20-QFN (3x3) surface-mount package with exposed pad, which affects PCB land pattern, soldering, and thermal layout. The 1.5 V to 5.5 V supply range and 24 nA supply current should be checked against the system power rail and supply current budget. The junction temperature range supports industrial automation contexts, but final thermal design should ensure the junction remains within this range under board-level conditions. The 3x3 package footprint should be considered during PCB placement. The EFP01 series and boost bootstrap PMIC function should be aligned with the intended power-management role in the design.
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