EFP0111GM20-E
EFP0111 BOOST BOOTSTRAP PMIC
Quick Answer: The EFP0111GM20-E from Silicon Labs is a specialized power management IC described as a boost bootstrap PMIC.
- Manufacturer
- Silicon Labs
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 20-VFQFN Exposed Pad
- Stock
- 2,443 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Silicon Labs |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Current - Supply | 24nA |
| Grade | Automotive |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | EFP01 |
| Supplier Device Package | 20-QFN (3x3) |
| Voltage - Supply | 1.5V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for EFP0111GM20-E.
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Detailed Description for EFP0111GM20-E
Product Overview
The EFP0111GM20-E from Silicon Labs is a specialized power management IC described as a boost bootstrap PMIC. It operates from a 1.5 V to 5.5 V supply and is specified with a 24 nA supply current. The device uses a 20-VFQFN exposed pad package with a 20-QFN (3x3) package type for surface-mount assembly. It has an automotive grade designation and a junction temperature range of -40°C to 100°C, for use in compact embedded power-management designs that require a low supply current.
Key Features
- Boost bootstrap PMIC function described in the product description.
- 1.5 V to 5.5 V supply voltage range.
- 24 nA supply current specification.
- Automotive grade designation.
- 20-VFQFN exposed pad package with 20-QFN (3x3) package type.
- Surface-mount mounting type.
- Junction temperature operating range of -40°C to 100°C.
Applications
- Automotive electronic modules using a specialized PMIC within a 1.5 V to 5.5 V supply range.
- Low-power embedded systems where a 24 nA supply current is relevant to power budgeting.
- Compact surface-mount boards that require a 20-QFN (3x3) power management package.
- Boost or bootstrap power management functions in compact electronic assemblies.
Design & Procurement Notes
The EFP0111GM20-E should be considered for designs that can accommodate a 20-VFQFN exposed pad and surface-mount assembly. The supply voltage must remain within 1.5 V to 5.5 V, and thermal design should account for a junction temperature range of -40°C to 100°C. The 24 nA supply current is useful for low-current power budget analysis. The automotive grade designation should be checked against the target system requirements. The 20-QFN (3x3) package supports compact layouts, but the exposed pad may require appropriate PCB land and thermal relief details.
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