EFP0102GM20-E
EFP0102 WIRED BUCK PMIC
Quick Answer: The EFP0102GM20-E from Silicon Labs is a wired buck PMIC in the EFP01 series, intended for power management functions in specialized electronic systems.
- Manufacturer
- Silicon Labs
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 20-VFQFN Exposed Pad
- Stock
- 2,470 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Silicon Labs |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Current - Supply | 24nA |
| Grade | Automotive |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | EFP01 |
| Supplier Device Package | 20-QFN (3x3) |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for EFP0102GM20-E.
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Detailed Description for EFP0102GM20-E
Product Overview
The EFP0102GM20-E from Silicon Labs is a wired buck PMIC in the EFP01 series, intended for power management functions in specialized electronic systems. It uses a 20-QFN (3x3) package, also described as a 20-VFQFN exposed pad case, and is intended for surface-mount assembly. The device carries an automotive grade and operates over a junction temperature range of -40°C to 100°C (TJ). Its supply current is 24nA, a supply-current characteristic relevant to power-aware designs. The compact package and PMIC function support integration into dense board layouts where a dedicated power management device is required.
Key Features
- Wired buck PMIC function in the EFP01 series.
- Automotive grade designation.
- Supply current of 24nA.
- Operating junction temperature range of -40°C to 100°C (TJ).
- 20-QFN (3x3) / 20-VFQFN exposed pad package.
- Surface-mount mounting type.
Applications
- Automotive electronic modules requiring automotive-grade power management.
- Surface-mount power conversion boards using a wired buck PMIC.
- Dense electronic assemblies using a compact PMIC.
Design & Procurement Notes
Design considerations should account for the 20-VFQFN exposed pad, surface-mount assembly, and compact 3x3 package footprint. The exposed pad should be considered during PCB layout and soldering preparation. The -40°C to 100°C (TJ) operating range supports thermal margin analysis, and the automotive grade should be considered when selecting for automotive power management contexts. The 24nA supply current is useful for supply-current analysis, while the wired buck PMIC function and EFP01 series designation should be matched to the intended power architecture. Procurement notes should focus on confirming package type, mounting type, grade, and thermal limits against system requirements.
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