EFP0108GM20-DR
EFP1018 SINGLE CELL BOOST PMIC
Quick Answer: The EFP0108GM20-DR from Silicon Labs is a specialized single-cell boost power management IC (PMIC).
- Manufacturer
- Silicon Labs
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 20-VFQFN Exposed Pad
- Stock
- 2,477 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Silicon Labs |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Industrial Automation |
| Current - Supply | 24nA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Discontinued at Digi-Key |
| Series | EFP01 |
| Supplier Device Package | 20-QFN (3x3) |
| Voltage - Supply | 0.8V ~ 1.8V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for EFP0108GM20-DR.
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Detailed Description for EFP0108GM20-DR
Product Overview
The EFP0108GM20-DR from Silicon Labs is a specialized single-cell boost power management IC (PMIC). It is part of the EFP01 series and is packaged in a 20-VFQFN exposed-pad package with a 20-QFN (3x3) footprint for surface-mount assembly. The device is specified for a supply voltage range of 0.8 V to 1.8 V, with a supply current of 24 nA and an operating junction temperature range of -40°C to 100°C. The compact package and specified 24 nA supply current support space-constrained surface-mount designs where power conversion, control, and thermal constraints are considered in a small footprint. The exposed-pad package supports compact board integration.
Key Features
- Single-cell boost PMIC architecture.
- Supply voltage range: 0.8 V to 1.8 V.
- Supply current: 24 nA.
- Operating junction temperature range: -40°C to 100°C.
- 20-VFQFN exposed-pad package.
- 20-QFN (3x3) device package.
- Surface-mount mounting type.
Applications
- Single-cell boost power rails in industrial control systems.
- Surface-mount power management in factory automation equipment.
Design & Procurement Notes
Designers should confirm that the system supply remains within 0.8 V to 1.8 V and that the thermal environment keeps the junction within -40°C to 100°C. The 20-QFN (3x3) exposed-pad package supports surface-mount assembly, but layout and soldering should account for the exposed pad, small footprint, and thermal management. The 24 nA supply current should be included in power budget calculations for low-current operating conditions. Board layout, input voltage, package type, and junction temperature should be reviewed against the specified limits during design.
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