XCVU3P-2FFVC1517E
IC FPGA 520 I/O 1517FCBGA
Quick Answer: The XCVU3P-2FFVC1517E from AMD is a Virtex UltraScale+ field programmable gate array device in a 1517-FCBGA (40x40) surface-mount package.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 1517-BBGA, FCBGA
- Stock
- 1,319 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Virtex® UltraScale+™ |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Voltage - Supply | 0.825V ~ 0.876V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XCVU3P-2FFVC1517E.
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Detailed Description for XCVU3P-2FFVC1517E
Product Overview
The XCVU3P-2FFVC1517E from AMD is a Virtex UltraScale+ field programmable gate array device in a 1517-FCBGA (40x40) surface-mount package. It provides 520 I/O pins, 862050 logic elements or cells, 49260 LABs/CLBs, and 130355200 total RAM bits. The supply voltage range is 0.825 V to 0.876 V, and the operating temperature range is 0°C to 100°C (TJ). These parameters define the device's configurable logic, embedded memory, interface capacity, package footprint, and electrical operating envelope for system integration.
Key Features
- Virtex UltraScale+ FPGA architecture with 862050 logic elements or cells and 49260 LABs/CLBs.
- 130355200 total RAM bits for on-device storage and buffering.
- 520 I/O pins for external interface and system connectivity.
- Supply voltage range of 0.825 V to 0.876 V.
- Operating temperature range of 0°C to 100°C (TJ).
- 1517-BBGA, FCBGA package with 1517-FCBGA (40x40) surface-mount form.
Applications
- Embedded control systems requiring configurable logic and direct I/O expansion.
- Signal processing subsystems that use FPGA logic and on-device RAM.
- Communication equipment interfaces where multiple I/O connections are needed.
- Test and measurement platforms using configurable logic for data handling.
- Computing acceleration designs using configurable logic for custom data paths.
Design & Procurement Notes
Design teams should map the available logic, RAM, and I/O resources to the target architecture before selecting the device. The 1517-FCBGA (40x40) surface-mount footprint requires PCB layout planning for the 520 I/O interfaces and the 0.825 V to 0.876 V supply range. Thermal and electrical design should respect the 0°C to 100°C (TJ) operating range, including junction temperature control during operation. Procurement and bill-of-materials review should confirm the 1517-BBGA, FCBGA package and the 1517-FCBGA (40x40) package to ensure the correct package is specified.
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