XCVU23P-1VSVA1365I
IC FPGA VIRTEX-UP 1365FCBGA
Quick Answer: AMD XCVU23P-1VSVA1365I is a Virtex UltraScale+ field programmable gate array (FPGA) for embedded logic and programmable system integration.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 1365-BFBGA, FCBGA
- Stock
- 1,439 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Virtex® UltraScale+™ |
| Supplier Device Package | 1365-FCBGA (35x35) |
| Voltage - Supply | 0.825V ~ 0.876V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XCVU23P-1VSVA1365I.
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Detailed Description for XCVU23P-1VSVA1365I
Product Overview
AMD XCVU23P-1VSVA1365I is a Virtex UltraScale+ field programmable gate array (FPGA) for embedded logic and programmable system integration. The device provides 2,252,250 logic elements/cells, 128,700 LABs/CLBs, 364 I/O, and 77,909,197 total RAM bits. It is offered in a 1365-BFBGA, FCBGA package, 1365-FCBGA (35 x 35), with surface-mount mounting. The specified supply voltage range is 0.825 V to 0.876 V, and the operating temperature range is -40°C to 100°C (TJ). These characteristics support designs requiring programmable logic, embedded memory, and multiple I/O connections.
Key Features
- Virtex UltraScale+ FPGA architecture with 2,252,250 logic elements/cells and 128,700 LABs/CLBs.
- 364 I/O for programmable board-level connections.
- 77,909,197 total RAM bits for on-device memory integration.
- 1365-BFBGA, FCBGA package, 1365-FCBGA (35 x 35).
- Surface-mount mounting type for board assembly.
- Supply voltage range of 0.825 V to 0.876 V.
- Operating temperature range of -40°C to 100°C (TJ).
Applications
- Embedded control logic in systems that require programmable state machines and custom peripherals.
- Programmable data-path processing where logic elements and total RAM bits are used for device-level data handling.
- Interface bridging using available I/O resources.
Design & Procurement Notes
When selecting AMD XCVU23P-1VSVA1365I, confirm that the board power architecture can meet the 0.825 V to 0.876 V supply requirement and that the thermal environment remains within -40°C to 100°C (TJ). The 1365-BFBGA, FCBGA package, 1365-FCBGA (35 x 35), and surface-mount mounting require footprint, land pattern, stencil, and reflow considerations appropriate to the package. The 364 I/O, 2,252,250 logic elements/cells, 128,700 LABs/CLBs, and 77,909,197 total RAM bits should be mapped against the target design's logic, memory, and pin-count needs before finalizing the FPGA choice.
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