XCVU57P-1FSVK2892E
IC FPGA VIRTEX-UP 2892BGA
Quick Answer: XCVU57P-1FSVK2892E is an AMD Virtex UltraScale+ field-programmable gate array (FPGA) intended for complex digital logic designs in a 2892-BBGA, FCBGA package.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 2892-BBGA, FCBGA
- Stock
- 1,341 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Last Time Buy |
| Series | Virtex® UltraScale+™ |
| Supplier Device Package | 2892-FCBGA (55x55) |
| Voltage - Supply | 0.825V ~ 0.876V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XCVU57P-1FSVK2892E.
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Detailed Description for XCVU57P-1FSVK2892E
Product Overview
XCVU57P-1FSVK2892E is an AMD Virtex UltraScale+ field-programmable gate array (FPGA) intended for complex digital logic designs in a 2892-BBGA, FCBGA package. The device provides 2,851,800 logic elements or cells, 162,960 LABs/CLBs, and 74,344,038 total RAM bits, with 624 I/O available for external interfaces. Its supply voltage range is 0.825 V to 0.876 V, and its specified operating temperature range is 0°C to 100°C junction temperature. The 2892-FCBGA (55x55) package form supports surface-mount assembly in high-density board designs.
Key Features
- AMD Virtex UltraScale+ FPGA with 2,851,800 logic elements or cells and 162,960 LABs/CLBs.
- 74,344,038 total RAM bits for internal data storage and buffering.
- 624 I/O for external device, memory, or interface connectivity.
- 0.825 V to 0.876 V supply voltage range.
- 0°C to 100°C junction operating temperature range.
- 2892-BBGA, FCBGA package with 2892-FCBGA (55x55) surface-mount form.
Applications
- Embedded control systems requiring custom digital logic and multiple external interface connections.
- Communications equipment data-path processing where high I/O count supports external interface planning.
- Automation control systems using FPGA logic for sensor, actuator, or interface tasks.
- Test and measurement instruments that need configurable logic and on-chip RAM resources.
Design & Procurement Notes
Design planning should account for the 2892-BBGA, FCBGA package and 2892-FCBGA (55x55) form, which require high-density PCB routing, many I/O paths, and reliable BGA soldering and inspection processes. The 0.825 V to 0.876 V supply range leaves a narrow voltage margin, so power distribution should be designed to maintain regulation across operating conditions. With 624 I/O, 162,960 LABs/CLBs, 2,851,800 logic elements or cells, and 74,344,038 total RAM bits, resource estimates should be based on the actual design's logic, memory, and interface requirements rather than package size alone. The specified 0°C to 100°C junction temperature range should be considered during thermal analysis.
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