XCVU3P-2FFVC1517E

Product Overview

The XCVU3P-2FFVC1517E from AMD is a Virtex UltraScale+ field programmable gate array device in a 1517-FCBGA (40x40) surface-mount package. It provides 520 I/O pins, 862050 logic elements or cells, 49260 LABs/CLBs, and 130355200 total RAM bits. The supply voltage range is 0.825 V to 0.876 V, and the operating temperature range is 0°C to 100°C (TJ). These parameters define the device's configurable logic, embedded memory, interface capacity, package footprint, and electrical operating envelope for system integration.

Key Features

• Virtex UltraScale+ FPGA architecture with 862050 logic elements or cells and 49260 LABs/CLBs.
• 130355200 total RAM bits for on-device storage and buffering.
• 520 I/O pins for external interface and system connectivity.
• Supply voltage range of 0.825 V to 0.876 V.
• Operating temperature range of 0°C to 100°C (TJ).
• 1517-BBGA, FCBGA package with 1517-FCBGA (40x40) surface-mount form.

Applications

• Embedded control systems requiring configurable logic and direct I/O expansion.
• Signal processing subsystems that use FPGA logic and on-device RAM.
• Communication equipment interfaces where multiple I/O connections are needed.
• Test and measurement platforms using configurable logic for data handling.
• Computing acceleration designs using configurable logic for custom data paths.

Design & Procurement Notes

Design teams should map the available logic, RAM, and I/O resources to the target architecture before selecting the device. The 1517-FCBGA (40x40) surface-mount footprint requires PCB layout planning for the 520 I/O interfaces and the 0.825 V to 0.876 V supply range. Thermal and electrical design should respect the 0°C to 100°C (TJ) operating range, including junction temperature control during operation. Procurement and bill-of-materials review should confirm the 1517-BBGA, FCBGA package and the 1517-FCBGA (40x40) package to ensure the correct package is specified.