XCVU37P-L2FSVH2892E
IC FPGA 624 I/O 2892FCBGA
Quick Answer: The XCVU37P-L2FSVH2892E is an AMD Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) for embedded designs requiring FPGA logic and I/O resources.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 2892-BBGA, FCBGA
- Stock
- 1,389 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Last Time Buy |
| Series | Virtex® UltraScale+™ |
| Supplier Device Package | 2892-FCBGA (55x55) |
| Voltage - Supply | 0.698V ~ 0.742V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XCVU37P-L2FSVH2892E.
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Detailed Description for XCVU37P-L2FSVH2892E
Product Overview
The XCVU37P-L2FSVH2892E is an AMD Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) for embedded designs requiring FPGA logic and I/O resources. The device is supplied in a 2892-BBGA, FCBGA package with a 2892-FCBGA (55x55) footprint and is mounted by surface-mount processes. Technical parameters include 624 I/O, 2,851,800 logic elements/cells, 162,960 LABs/CLBs, and 74,344,038 total RAM bits. The specified supply voltage range is 0.698V ~ 0.742V, with an operating temperature range of 0°C ~ 100°C (TJ).
Key Features
- AMD Virtex® UltraScale+™ FPGA
- 2,851,800 logic elements/cells
- 162,960 LABs/CLBs
- 74,344,038 total RAM bits
- 624 I/O
- Supply voltage range: 0.698V ~ 0.742V
- Operating temperature: 0°C ~ 100°C (TJ)
- 2892-BBGA, FCBGA package
- 2892-FCBGA (55x55) device package
- Surface-mount mounting type
Applications
- Embedded control and interface logic using the 624 I/O count
- On-chip buffering and memory-assisted logic functions in FPGA-based subsystems
- High-density digital logic integration in surface-mount system boards
- Designs constrained by a 0°C to 100°C junction-temperature operating envelope
Design & Procurement Notes
Design and procurement notes: The 2892-FCBGA (55x55) package and surface-mount mounting type require a matching PCB footprint and assembly process. The 624 I/O count should be mapped early to board-level connector, power, and signal-integrity planning. The 0.698V ~ 0.742V supply range and 0°C ~ 100°C (TJ) operating temperature should be reflected in power-rail regulation and thermal design. The 74,344,038 total RAM bits, 162,960 LABs/CLBs, and 2,851,800 logic elements/cells provide a basis for sizing on-chip memory and logic partitioning. Confirm package drawing and land pattern from AMD before layout.
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