XCVU19P-1FSVA3824E
IC FPGA VIRTEX-UP 3824FCBGA
Quick Answer: The AMD XCVU19P-1FSVA3824E is a Virtex® UltraScale+™ field-programmable gate array (FPGA) supplied in a 3824-BBGA, FCBGA package.
- Manufacturer
- AMD
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 3824-BBGA, FCBGA
- Stock
- 1,304 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | AMD |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | Virtex® UltraScale+™ |
| Supplier Device Package | 3824-FCBGA (65x65) |
| Voltage - Supply | 0.825V ~ 0.876V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for XCVU19P-1FSVA3824E.
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Detailed Description for XCVU19P-1FSVA3824E
Product Overview
The AMD XCVU19P-1FSVA3824E is a Virtex® UltraScale+™ field-programmable gate array (FPGA) supplied in a 3824-BBGA, FCBGA package. It is intended for designs that require a large reconfigurable logic fabric, extensive I/O resources, and on-device memory. The device provides 8,937,600 logic elements/cells, 510,720 LABs/CLBs, 79,586,918 total RAM bits, and 2,072 I/O pins. Its specified supply voltage range is 0.825 V to 0.876 V, and its operating temperature range is 0°C to 100°C (TJ).
Key Features
- Virtex® UltraScale+™ FPGA architecture for reconfigurable logic designs.
- 8,937,600 logic elements/cells and 510,720 LABs/CLBs.
- 79,586,918 total RAM bits available for on-device storage and buffering.
- 2,072 I/O pins for complex board-level interconnection.
- 3824-BBGA, FCBGA surface-mount package; 3824-FCBGA (65 x 65).
- Supply voltage specified from 0.825 V to 0.876 V.
- Operating temperature specified as 0°C to 100°C (TJ).
Applications
- Embedded systems requiring a large reconfigurable logic fabric.
- Computing platforms where custom data paths are implemented in FPGA logic.
- Communications infrastructure equipment that needs flexible protocol handling and signal processing.
- Data center acceleration cards using FPGA logic for offload processing.
- Video and image processing systems using FPGA logic for pixel pipeline functions.
Design & Procurement Notes
When selecting this FPGA, verify that the PCB footprint matches the 3824-BBGA, FCBGA surface-mount package and the 3824-FCBGA (65 x 65) package dimensions. The 2,072 I/O count and large logic/RAM resources can require significant routing layers, power delivery, and thermal management. Ensure the board supply design maintains the specified 0.825 V to 0.876 V range and that system thermal design keeps junction temperature within 0°C to 100°C. Consider the device's logic cell count, LAB/CLB count, and total RAM bits when planning resource utilization and memory architecture.
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