XCVU57P-L2FSVK2892E

Product Overview

The XCVU57P-L2FSVK2892E is an AMD Virtex UltraScale+ field programmable gate array (FPGA) in a 2892-BBGA, FCBGA package with 2892-FCBGA (55x55) package designation. The device integrates 2,851,800 logic elements/cells and 162,960 LABs/CLBs, with 74,344,038 total RAM bits and 624 I/O pins. It is a surface mount IC for programmable logic, signal processing, and embedded control functions where a large FPGA fabric and RAM resources are required. The supply voltage range is 0.698 V to 0.742 V, and the operating junction temperature range is 0°C to 110°C (TJ).

Key Features

• Virtex UltraScale+ FPGA architecture with 2,851,800 logic elements/cells.
• 162,960 LABs/CLBs and 74,344,038 total RAM bits for programmable logic and on-chip storage.
• 624 I/O pins for external interface and system connectivity.
• Surface mount 2892-BBGA, FCBGA package; 2892-FCBGA (55x55) package designation.
• Supply voltage range 0.698 V to 0.742 V and operating junction temperature range 0°C to 110°C (TJ).

Applications

• Embedded control systems requiring reconfigurable digital logic.
• Signal processing and data aggregation functions requiring a large programmable logic fabric.
• High pin-count interface expansion and on-chip RAM buffering.

Design & Procurement Notes

When selecting the XCVU57P-L2FSVK2892E, verify that the PCB stackup, power delivery, and thermal design can support a surface mount 2892-BBGA/FCBGA FPGA with a 0.698 V to 0.742 V supply range and operation up to 110°C junction temperature. The 624 I/O pins and 74,344,038 total RAM bits are relevant when planning I/O assignment and on-chip memory usage. The 2892-FCBGA (55x55) package footprint requires adequate PCB area, routing layers, and assembly capability, so confirm the land pattern and thermal management strategy during schematic and layout planning.