XCVU37P-L2FSVH2892E

Product Overview

The XCVU37P-L2FSVH2892E is an AMD Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) for embedded designs requiring FPGA logic and I/O resources. The device is supplied in a 2892-BBGA, FCBGA package with a 2892-FCBGA (55x55) footprint and is mounted by surface-mount processes. Technical parameters include 624 I/O, 2,851,800 logic elements/cells, 162,960 LABs/CLBs, and 74,344,038 total RAM bits. The specified supply voltage range is 0.698V ~ 0.742V, with an operating temperature range of 0°C ~ 100°C (TJ).

Key Features

• AMD Virtex® UltraScale+™ FPGA
• 2,851,800 logic elements/cells
• 162,960 LABs/CLBs
• 74,344,038 total RAM bits
• 624 I/O
• Supply voltage range: 0.698V ~ 0.742V
• Operating temperature: 0°C ~ 100°C (TJ)
• 2892-BBGA, FCBGA package
• 2892-FCBGA (55x55) device package
• Surface-mount mounting type

Applications

• Embedded control and interface logic using the 624 I/O count
• On-chip buffering and memory-assisted logic functions in FPGA-based subsystems
• High-density digital logic integration in surface-mount system boards
• Designs constrained by a 0°C to 100°C junction-temperature operating envelope

Design & Procurement Notes

Design and procurement notes: The 2892-FCBGA (55x55) package and surface-mount mounting type require a matching PCB footprint and assembly process. The 624 I/O count should be mapped early to board-level connector, power, and signal-integrity planning. The 0.698V ~ 0.742V supply range and 0°C ~ 100°C (TJ) operating temperature should be reflected in power-rail regulation and thermal design. The 74,344,038 total RAM bits, 162,960 LABs/CLBs, and 2,851,800 logic elements/cells provide a basis for sizing on-chip memory and logic partitioning. Confirm package drawing and land pattern from AMD before layout.