XCVU19P-1FSVA3824E

Product Overview

The AMD XCVU19P-1FSVA3824E is a Virtex® UltraScale+™ field-programmable gate array (FPGA) supplied in a 3824-BBGA, FCBGA package. It is intended for designs that require a large reconfigurable logic fabric, extensive I/O resources, and on-device memory. The device provides 8,937,600 logic elements/cells, 510,720 LABs/CLBs, 79,586,918 total RAM bits, and 2,072 I/O pins. Its specified supply voltage range is 0.825 V to 0.876 V, and its operating temperature range is 0°C to 100°C (TJ).

Key Features

• Virtex® UltraScale+™ FPGA architecture for reconfigurable logic designs.
• 8,937,600 logic elements/cells and 510,720 LABs/CLBs.
• 79,586,918 total RAM bits available for on-device storage and buffering.
• 2,072 I/O pins for complex board-level interconnection.
• 3824-BBGA, FCBGA surface-mount package; 3824-FCBGA (65 x 65).
• Supply voltage specified from 0.825 V to 0.876 V.
• Operating temperature specified as 0°C to 100°C (TJ).

Applications

• Embedded systems requiring a large reconfigurable logic fabric.
• Computing platforms where custom data paths are implemented in FPGA logic.
• Communications infrastructure equipment that needs flexible protocol handling and signal processing.
• Data center acceleration cards using FPGA logic for offload processing.
• Video and image processing systems using FPGA logic for pixel pipeline functions.

Design & Procurement Notes

When selecting this FPGA, verify that the PCB footprint matches the 3824-BBGA, FCBGA surface-mount package and the 3824-FCBGA (65 x 65) package dimensions. The 2,072 I/O count and large logic/RAM resources can require significant routing layers, power delivery, and thermal management. Ensure the board supply design maintains the specified 0.825 V to 0.876 V range and that system thermal design keeps junction temperature within 0°C to 100°C. Consider the device's logic cell count, LAB/CLB count, and total RAM bits when planning resource utilization and memory architecture.