LFE2-70E-6FN900C
IC FPGA 583 I/O 900FBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 900-BBGA
- 庫存
- 1,496 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 900-FPBGA (31x31) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-70E-6FN900C 的主要供貨及採購資訊。
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LFE2-70E-6FN900C 詳細描述
Product Overview
The LFE2-70E-6FN900C is a Lattice Semiconductor Corporation ECP2 field programmable gate array device in a 900-BBGA surface-mount package. It is described as an IC FPGA with 583 I/O, 68000 logic elements/cells, 8500 LABs/CLBs, and 1056768 total RAM bits. The supply voltage range is 1.14V to 1.26V, and the operating temperature range is 0°C to 85°C at the junction. The supplier device package is 900-FPBGA (31x31), and the lifecycle status is Active.
Key Features
- ECP2 series FPGA from Lattice Semiconductor Corporation
- 583 I/O available for board-level connectivity and I/O expansion
- 68000 logic elements/cells and 8500 LABs/CLBs for programmable logic implementation
- 1056768 total RAM bits for embedded memory structures
- 1.14V to 1.26V supply voltage range
- 0°C to 85°C operating temperature range at the junction
- 900-BBGA surface-mount package with supplier device package 900-FPBGA (31x31)
Applications
- Programmable control logic in embedded systems where user-defined digital functions are required
- I/O expansion and signal routing using the 583 available I/O
- On-chip buffering or lookup tables supported by the 1056768 total RAM bits
- Logic-intensive subsystem integration in commercial-temperature electronic assemblies
Design & Procurement Notes
For design planning, confirm that the 1.14V to 1.26V supply range, 0°C to 85°C junction temperature, and 900-BBGA surface-mount footprint match the board layout, power tree, and thermal environment. The 583 I/O count, 68000 logic elements/cells, 8500 LABs/CLBs, and 1056768 total RAM bits should be compared against the target logic, memory, and connectivity requirements before selecting this ECP2 FPGA. Procurement teams should also verify the Active lifecycle status and the 900-FPBGA (31x31) supplier device package when preparing BOM and manufacturing documentation.
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