LCMXO3LF-1300E-5UWG36ITR
IC FPGA 28 I/O 36WLCSP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 36-UFBGA, WLCSP
- 庫存
- 10,000 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT),Digi-Reel® |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 36-WLCSP (2.54x2.59) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3LF-1300E-5UWG36ITR 的主要供貨及採購資訊。
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LCMXO3LF-1300E-5UWG36ITR 詳細描述
Product Overview
The LCMXO3LF-1300E-5UWG36ITR is a MachXO3 series field programmable gate array from Lattice Semiconductor Corporation. It provides 1280 logic elements organized into 160 LABs/CLBs, along with 65536 total RAM bits and 28 user I/O. The device operates from a 1.14V to 1.26V supply and is specified for junction temperatures from -40°C to 100°C. It is supplied as a surface-mount 36-UFBGA, WLCSP device, with the supplier device package identified as 36-WLCSP (2.54x2.59).
Key Features
- MachXO3 FPGA with 1280 logic elements and 160 LABs/CLBs.
- Includes 65536 total RAM bits.
- 28 I/O for low-pin-count signal connectivity.
- 1.14V ~ 1.26V supply voltage range.
- -40°C ~ 100°C (TJ) operating temperature range.
- Surface-mount 36-UFBGA, WLCSP package, supplied as 36-WLCSP (2.54x2.59).
Applications
- Compact embedded board control logic where only 28 I/O are required.
- Signal adaptation between onboard peripherals and a host controller in low-pin-count systems.
- Consolidation of discrete board-level logic into a single surface-mount WLCSP device.
Design & Procurement Notes
When evaluating this MachXO3 device, compare the 28 available I/O and 160 LABs/CLBs against the design's signal count, logic partitioning, and routing needs. The 1280 logic elements and 65536 RAM bits define the available implementation resources, so they should be checked against the intended logic functions and small memory requirements. Confirm that the system power architecture can provide the required 1.14V to 1.26V supply. The -40°C to 100°C junction temperature specification should be reviewed alongside board-level thermal conditions. Because the device is a surface-mount 36-UFBGA, WLCSP part with a 36-WLCSP (2.54x2.59) package, assembly capability, land pattern, and inspection requirements should be considered.
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