LCMXO3LF-2100E-5UWG49CTR1K
IC FPGA 38 I/O 49WLCSP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 49-UFBGA, WLCSP
- 庫存
- 14,595 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT),Digi-Reel® |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 49-WLCSP (3.11x3.19) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3LF-2100E-5UWG49CTR1K 的主要供貨及採購資訊。
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LCMXO3LF-2100E-5UWG49CTR1K 詳細描述
Product Overview
The LCMXO3LF-2100E-5UWG49CTR1K is a MachXO3 field programmable gate array from Lattice Semiconductor Corporation. It combines 2112 logic elements or cells, 264 LABs/CLBs, 75776 total RAM bits, and 38 I/O in a surface-mount package. The device is intended for configurable digital logic where a low pin count and small package outline are important. It operates from a 1.14V to 1.26V supply and is specified over a 0°C to 85°C junction temperature range. The supplied package is a 49-UFBGA, WLCSP, with the supplier device package identified as 49-WLCSP (3.11x3.19). The listed .
Key Features
- 2112 logic elements/cells and 264 LABs/CLBs provide the configurable logic resources.
- 75776 total RAM bits provide on-device memory resources.
- 38 I/O are available for connection to external digital signals.
- The 1.14V ~ 1.26V supply range defines the required power envelope.
- The surface-mount 49-UFBGA, WLCSP package is supplied as a 49-WLCSP (3.11x3.19) device package.
Applications
- Board-level control logic in embedded electronic assemblies.
- Signal aggregation and routing among a limited set of digital peripherals.
- Interface adaptation in designs constrained to a small surface-mount package.
- Consolidation of discrete glue logic into a single programmable device.
Design & Procurement Notes
When selecting this MachXO3 device, compare the 38 I/O count, 2112 logic elements/cells, 264 LABs/CLBs, and 75776 total RAM bits against the required pin allocation, logic density, and RAM capacity. Confirm that the power distribution network can maintain the specified 1.14V ~ 1.26V supply range across operating conditions. The 0°C to 85°C junction temperature range should be evaluated against the expected thermal environment of the final assembly. Because the part is supplied in a 49-UFBGA, WLCSP with a 49-WLCSP (3.11x3.19) supplier package, PCB footprint, placement clearances, and surface-mount assembly constraints should be checked before layout release. The listed status is Active.
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