LIFCL-17-8UWG72I
IC FPGA 40 I/O 72WLCSP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 72-BGA, WLCSP
- 庫存
- 7,027 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT),Digi-Reel® |
| Product status | Active |
| Series | CrossLink-NX™ |
| Supplier Device Package | 72-WLCSP (3.7x4.1) |
| Voltage - Supply | 0.95V ~ 1.05V |
| 資料表 | 查看資料表PDF |
採購概覽
LIFCL-17-8UWG72I 的主要供貨及採購資訊。
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LIFCL-17-8UWG72I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LIFCL-17-8UWG72I is an Active CrossLink-NX™ field programmable gate array supplied in a 72-WLCSP surface-mount package for embedded designs. The device provides 40 I/O, 17000 logic elements or cells, 4250 LABs or CLBs, and 442368 total RAM bits. It operates from a 0.95V to 1.05V supply and specifies a junction temperature range of -40°C to 100°C.
Key Features
- CrossLink-NX™ FPGA with 17000 logic elements or cells and 4250 LABs or CLBs.
- 40 I/O and 442368 total RAM bits are supplied for programmable digital logic and on-chip storage.
- The supply voltage is 0.95V to 1.05V.
- The package/case is 72-BGA, WLCSP, with supplier device package 72-WLCSP (3.7x4.1).
- The mounting type is surface mount.
- The operating temperature is -40°C to 100°C (TJ).
- .
Applications
- Custom digital control logic in compact embedded equipment.
- Programmable data-path functions using the 40 I/O and on-chip RAM bits.
- Configurable logic for system bring-up or external signal control in space-constrained designs.
Design & Procurement Notes
Designers should evaluate the 40 I/O count, 17000 logic elements or cells, 442368 total RAM bits, and 0.95V to 1.05V supply range against the required logic resources and power architecture of the target system. The 72-WLCSP (3.7x4.1) surface-mount package and -40°C to 100°C (TJ) operating range are relevant for compact embedded layouts and thermal planning. Procurement teams can confirm lifecycle status as Active and verify package markings and ordering data before board placement.
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