LFE2-20E-7FN256C
IC FPGA 193 I/O 256FBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-BGA
- 庫存
- 1,434 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 256-FPBGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-20E-7FN256C 的主要供貨及採購資訊。
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LFE2-20E-7FN256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LFE2-20E-7FN256C is an ECP2 field programmable gate array for embedded designs that require configurable digital logic. The device provides 21,000 logic elements or cells, 2,625 LABs/CLBs, and 282,624 total RAM bits in a 256-BGA package. It offers 193 I/O pins and operates from a 1.14 V to 1.26 V supply. The package is 256-BGA, with a 256-FPBGA (17x17) device package, and the mounting type is surface mount. Its junction temperature range is 0°C to 85°C, supporting embedded logic implementations within that range.
Key Features
- ECP2 FPGA family with 21,000 logic elements or cells and 2,625 LABs/CLBs
- 282,624 total RAM bits for on-chip memory capacity
- 193 I/O pins in a 256-BGA package
- 1.14 V to 1.26 V supply voltage
- Surface-mount 256-FPBGA (17x17) package
- 0°C to 85°C junction temperature operating range
Applications
- Embedded control logic where configurable digital functions replace multiple fixed-function components
- Data-path processing in systems that need internal RAM and user I/O expansion
- Custom interface and protocol logic in surface-mount designs using the 256-FPBGA (17x17) package
Design & Procurement Notes
Design teams should verify the 1.14 V to 1.26 V supply tolerance and decoupling strategy in the board design because the device is surface mount in a 256-FPBGA (17x17) package. The 193 I/O count and 282,624 RAM bits define the available logic and on-chip memory resources for a chosen implementation. The 0°C to 85°C junction temperature range should be checked against expected board thermal conditions. The 17x17 package outline and surface-mount termination affect layout, assembly profile, and rework access.
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