LFE2-20E-5FN484I
IC FPGA 331 I/O 484FBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 484-BBGA
- 庫存
- 1,295 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 484-FPBGA (23x23) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-20E-5FN484I 的主要供貨及採購資訊。
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LFE2-20E-5FN484I 詳細描述
Product Overview
The LFE2-20E-5FN484I is a Lattice Semiconductor Corporation ECP2 series FPGA for embedded logic design. The device provides 21000 logic elements/cells and 2625 LABs/CLBs, along with 282624 total RAM bits and 331 I/O pins. It is supplied in a 484-FPBGA (23x23) surface-mount package and operates from a 1.14 V to 1.26 V supply. The specified junction temperature range is -40°C to 100°C. This FPGA can be used for configurable interconnect, control logic, and custom data-path functions within embedded systems.
Key Features
- ECP2 FPGA architecture with 21000 logic elements/cells and 2625 LABs/CLBs.
- 282624 total RAM bits available as internal memory resources.
- 331 I/O pins for system interfacing and configurable signal routing.
- 1.14 V to 1.26 V supply voltage.
- -40°C to 100°C (TJ) operating temperature range.
- 484-FPBGA (23x23) surface-mount package.
Applications
- Embedded control logic where configurable state machines and custom digital functions replace fixed-function logic.
- Configurable interface adaptation between a host processor and board-level peripherals or custom signals.
- Custom data-path logic for framing, buffering, or deterministic processing within embedded designs.
Design & Procurement Notes
Design teams should size the FPGA around the available 21000 logic elements/cells, 2625 LABs/CLBs, 282624 total RAM bits, and 331 I/O pins. The 1.14 V to 1.26 V supply range requires a regulated supply compatible with the device. The 484-FPBGA (23x23) surface-mount package should be reflected in the PCB footprint and assembly process. The -40°C to 100°C (TJ) range should be considered in thermal planning, with actual junction temperature managed through board power and thermal design.
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