LFE2-12SE-6TN144I
IC FPGA 93 I/O 144TQFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 144-LQFP
- 庫存
- 1,472 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 144-TQFP (20x20) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-12SE-6TN144I 的主要供貨及採購資訊。
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LFE2-12SE-6TN144I 詳細描述
Product Overview
The LFE2-12SE-6TN144I is a field programmable gate array from Lattice Semiconductor Corporation, part of the ECP2 series. The device is packaged in a 144-TQFP (20x20) case and uses surface-mount mounting. It provides 93 I/O pins, 12000 logic elements/cells, 1500 LABs/CLBs, and 226304 total RAM bits. The supply voltage range is 1.14 V to 1.26 V, and the junction operating temperature range is -40°C to 100°C.
Key Features
- 12000 logic elements/cells and 1500 LABs/CLBs support programmable logic implementation.
- 226304 total RAM bits provide on-chip memory resources.
- 93 I/O pins are available in the 144-TQFP package.
- The device operates from a 1.14 V to 1.26 V supply.
- Junction temperature range is -40°C to 100°C.
- Surface-mount package is 144-TQFP (20x20).
Applications
- Programmable logic control in embedded systems.
- Interface adaptation between digital subsystems.
- Data buffering using on-chip RAM resources.
- Custom digital processing in surface-mount designs.
Design & Procurement Notes
Design considerations include the 1.14 V to 1.26 V supply range, the -40°C to 100°C junction temperature range, and the 144-TQFP (20x20) surface-mount package. The 93 available I/O pins, 12000 logic elements/cells, 1500 LABs/CLBs, and 226304 total RAM bits define the logic, memory, and interface capacity that should be matched to the target circuit architecture. Procurement should focus on the exact manufacturer part number LFE2-12SE-6TN144I and the specified package type to ensure consistency with the intended footprint and electrical connections. The package type and pin count should be reviewed against the board layout.
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