LFE2-12SE-6FN484I
IC FPGA 297 I/O 484FBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 484-BBGA
- 庫存
- 1,487 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 484-FPBGA (23x23) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-12SE-6FN484I 的主要供貨及採購資訊。
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LFE2-12SE-6FN484I 詳細描述
Product Overview
The LFE2-12SE-6FN484I from Lattice Semiconductor Corporation is an ECP2 field programmable gate array (FPGA) intended for board-level embedded logic. It provides 12,000 logic elements/cells, 1,500 LABs/CLBs, 297 I/O, and 226,304 total RAM bits in a 484-FPBGA (23 mm x 23 mm) surface-mount package. The device operates from a 1.14 V to 1.26 V supply and is specified for a junction temperature range of -40°C to 100°C.
Key Features
- 12,000 logic elements/cells for implementing custom digital logic functions.
- 1,500 LABs/CLBs within the ECP2 FPGA fabric.
- 297 I/O pins available for external interface and board-level signal connections.
- 226,304 total RAM bits for on-device data storage and buffering.
- 1.14 V to 1.26 V supply voltage range.
- Surface-mount 484-FPBGA (23 mm x 23 mm) package, also identified as 484-BBGA.
- Operating junction temperature range of -40°C to 100°C.
Applications
- Embedded control boards requiring custom glue logic, state machines, or timing functions.
- Measurement or acquisition hardware using on-device RAM bits for data formatting and buffering.
- Board-level interface adaptation between custom digital buses.
- Embedded processing subsystems requiring configurable logic resources.
Design & Procurement Notes
Design considerations should focus on the 1.14 V to 1.26 V supply range, surface-mount 484-FPBGA (23 mm x 23 mm) footprint, and 297 I/O count when planning power supply connections, PCB routing, and connector or peripheral interfaces. The -40°C to 100°C junction temperature range should be used as the thermal design limit for the board environment. The 12,000 logic elements/cells, 1,500 LABs/CLBs, and 226,304 total RAM bits can be used to estimate logic and on-device memory resources before detailed implementation.
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