LFE2-12SE-5FN484I
IC FPGA 297 I/O 484FBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 484-BBGA
- 庫存
- 1,329 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 484-FPBGA (23x23) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-12SE-5FN484I 的主要供貨及採購資訊。
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LFE2-12SE-5FN484I 詳細描述
Product Overview
The LFE2-12SE-5FN484I from Lattice Semiconductor Corporation is an ECP2 field programmable gate array (FPGA) intended for embedded logic applications. The device provides 297 I/O connections, 12,000 logic elements/cells, 1,500 LABs/CLBs, and 226,304 total RAM bits in a surface mount 484-BBGA package, with a 484-FPBGA (23x23) package. Its supply voltage range is 1.14 V to 1.26 V, and its specified junction temperature range is -40°C to 100°C.
Key Features
- ECP2 FPGA architecture with 12,000 logic elements/cells and 1,500 LABs/CLBs.
- 297 I/O resources for external digital interfacing.
- 226,304 total RAM bits available for on-chip storage or buffering.
- 1.14 V to 1.26 V supply voltage range.
- Surface mount 484-BBGA package; 484-FPBGA (23x23) package.
- Operating junction temperature range of -40°C to 100°C.
Applications
- Implementation of custom digital control logic in embedded systems.
- Replacement of multiple discrete logic devices within a board-level design.
- Use of on-chip RAM for buffering or data storage.
- Connection of external peripherals and signals through the available I/O count.
Design & Procurement Notes
Designers should plan for the 1.14 V to 1.26 V supply range, surface mount assembly, and the 484-BBGA package footprint, with the 484-FPBGA (23x23) package considered during layout. The supply range should be maintained during operation. The 297 I/O count, 12,000 logic elements/cells, 1,500 LABs/CLBs, and 226,304 total RAM bits define the available logic and storage resources for a design. The -40°C to 100°C junction temperature range should be considered together with board thermal behavior and operating conditions.
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