LFE2-12E-6QN208I
IC FPGA 131 I/O 208QFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 208-BFQFP
- 庫存
- 1,319 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2 |
| Supplier Device Package | 208-PQFP (28x28) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2-12E-6QN208I 的主要供貨及採購資訊。
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LFE2-12E-6QN208I 詳細描述
Product Overview
Lattice Semiconductor Corporation LFE2-12E-6QN208I is an ECP2 field programmable gate array in a 208-BFQFP surface-mount package with a 208-PQFP (28x28) footprint. The device provides 131 I/O pins, 12000 logic elements or cells, 1500 LABs/CLBs, and 226304 total RAM bits. The supply voltage range is 1.14 V to 1.26 V, and the operating junction temperature range is -40°C to 100°C.
Key Features
- ECP2 FPGA architecture with 12000 logic elements or cells and 1500 LABs/CLBs.
- 226304 total RAM bits for on-device memory structures.
- 131 I/O pins for external logic, bus, and peripheral connections.
- 208-BFQFP surface-mount package with a 208-PQFP (28x28) footprint.
- Operation from 1.14 V to 1.26 V supply over a -40°C to 100°C junction temperature range.
Applications
- Programmable control logic for embedded systems requiring custom state machines or peripheral interfaces.
- Data-path aggregation and formatting between sensors, memories, buses, or external logic devices.
- Protocol bridging and glue logic in board designs using 131 available I/O pins.
Design & Procurement Notes
Design planning should account for the 1.14 V to 1.26 V supply requirement and the 208-PQFP (28x28) surface-mount footprint when defining power delivery and PCB layout. The 131 I/O count, 12000 logic elements or cells, 1500 LABs/CLBs, and 226304 total RAM bits define the available logic and memory budget for the target design. The -40°C to 100°C junction temperature range should be considered with the final board thermal environment, package heat dissipation, and device placement.
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