LFCPNX-50-8BFG484I
IC FPGA CERTUSPRO-NX 484BGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 484-BBGA
- 庫存
- 1,432 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | CertusPro™-NX |
| Supplier Device Package | 484-FPBGA (23x23) |
| Voltage - Supply | 0.95V ~ 1.05V |
| 資料表 | 查看資料表PDF |
採購概覽
LFCPNX-50-8BFG484I 的主要供貨及採購資訊。
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LFCPNX-50-8BFG484I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LFCPNX-50-8BFG484I is a CertusPro™-NX field programmable gate array (FPGA) in a 484-BBGA surface-mount package. The device provides 52000 logic elements, 13000 LABs/CLBs, 273 I/O pins, and 1769472 total RAM bits for reconfigurable digital logic and on-chip storage. It operates from a 0.95 V to 1.05 V supply and is specified for a junction temperature range of -40°C to 100°C.
Key Features
- CertusPro™-NX FPGA architecture with 52000 logic elements and 13000 LABs/CLBs
- 273 I/O pins for system-level signal connection and logic interfacing
- 1769472 total RAM bits for embedded buffering and temporary data storage
- 0.95 V to 1.05 V supply voltage range
- 484-BBGA surface-mount package, with 484-FPBGA (23x23) supplier device package
- -40°C to 100°C junction temperature operating range
Applications
- Reconfigurable control logic in embedded systems
- Sensor signal aggregation and pre-processing using available I/O and embedded RAM
- Protocol bridging or signal routing between logic domains
- Data buffering and temporary storage within programmable logic designs
- Hardware customization for systems requiring FPGA logic resources and I/O count
Design & Procurement Notes
Design considerations include providing a regulated 0.95 V to 1.05 V supply, managing junction temperature within -40°C to 100°C, and using a PCB land pattern compatible with the 484-BBGA / 484-FPBGA (23x23) surface-mount package. The 273 I/O pins, 52000 logic elements, and 1769472 RAM bits should be allocated during pin planning, logic sizing, and embedded memory mapping. Procurement notes should focus on package dimensions, soldering process compatibility, and power delivery requirements for the specified supply and temperature limits.
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