LFCPNX-50-7CBG256I
IC FPGA CERTUSPRO-NX 256WLP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,393 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | CertusPro™-NX |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 0.95V ~ 1.05V |
| 資料表 | 查看資料表PDF |
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LFCPNX-50-7CBG256I 的主要供貨及採購資訊。
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LFCPNX-50-7CBG256I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LFCPNX-50-7CBG256I is a CertusPro-NX field programmable gate array (FPGA) in a 256-LFBGA surface-mount package, with a 256-CABGA (14x14) device package. It provides 13,000 LABs/CLBs, 52,000 logic elements/cells, 1,769,472 total RAM bits, and 167 I/O. The device operates from a 0.95 V to 1.05 V supply and is specified for a junction temperature range of -40°C to 100°C.
Key Features
- 13,000 LABs/CLBs and 52,000 logic elements/cells provide configurable logic resources.
- 1,769,472 total RAM bits are available for on-chip data storage and buffering.
- 167 I/O pins support external signal connection and board-level interface planning.
- 0.95 V to 1.05 V supply range defines the required supply margin.
- 256-LFBGA surface-mount package with 256-CABGA (14x14) device package.
- -40°C to 100°C junction temperature range allows thermal budgeting in board designs.
Applications
- Embedded control logic in systems requiring configurable digital processing.
- Data aggregation and formatting from multiple external sources using on-chip RAM resources.
- Protocol bridging and glue logic between heterogeneous subsystems.
- I/O expansion and signal routing on a circuit board.
Design & Procurement Notes
Design considerations include providing the 0.95 V to 1.05 V supply and evaluating the 167 available I/O against required external connections. The 13,000 LABs/CLBs, 52,000 logic elements/cells, and 1,769,472 total RAM bits should be compared with the logic, state-machine, and buffering needs of the target design. The 256-LFBGA surface-mount package and 256-CABGA (14x14) device package require PCB footprint planning, while the -40°C to 100°C junction temperature range should be included in thermal margin calculations. When selecting the part, use the exact manufacturer part number LFCPNX-50-7CBG256I and verify that the package and supply requirements match the board-level architecture.
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