LFCPNX-100-9BFG484C
IC FPGA CERTUSPRO-NX 484BGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 484-BBGA
- 庫存
- 1,325 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | CertusPro™-NX |
| Supplier Device Package | 484-FPBGA (23x23) |
| Voltage - Supply | 0.95V ~ 1.05V |
| 資料表 | 查看資料表PDF |
採購概覽
LFCPNX-100-9BFG484C 的主要供貨及採購資訊。
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LFCPNX-100-9BFG484C 詳細描述
Product Overview
The LFCPNX-100-9BFG484C is a CertusPro™-NX field programmable gate array from Lattice Semiconductor Corporation. It is supplied in a 484-BBGA package with a 484-FPBGA (23 x 23) device footprint and is intended for surface-mount assembly. The device provides 96,000 logic elements or cells, 24,000 LABs or CLBs, 309 I/O pins, and 3,833,856 total RAM bits. Its specified supply voltage range is 0.95 V to 1.05 V, and its operating junction temperature range is 0°C to 85°C.
Key Features
- 96,000 logic elements or cells and 24,000 LABs or CLBs for programmable digital logic integration.
- 309 user I/O pins and 3,833,856 total RAM bits.
- 484-BBGA package with 484-FPBGA (23 x 23) device package for surface mounting.
- 0.95 V to 1.05 V supply voltage and 0°C to 85°C (TJ) operating temperature.
Applications
- Programmable digital control logic for embedded systems.
- Reconfigurable signal processing or data routing in compact board designs.
- Interface bridging and protocol adaptation using available FPGA logic and I/O resources.
Design & Procurement Notes
Design and procurement planning should account for the 0.95 V to 1.05 V supply window, the 0°C to 85°C (TJ) operating junction temperature range, and the 484-BBGA surface-mount package. The 484-FPBGA (23 x 23) device package dimension and 309 I/O count affect PCB routing, thermal management, and connector planning. The 96,000 logic elements or cells, 24,000 LABs or CLBs, and 3,833,856 total RAM bits define the programmable logic and on-chip storage resources for the design. Board-level supply regulation, mounting, and interconnect planning should align with these specified parameters without assuming capabilities beyond the stated specifications.
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