料號

LCMXO3LF-2100E-6MG121C

IC FPGA 100 I/O 121CSFBGA

封裝
121-VFBGA, CSPBGA
庫存
1,448 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series MachXO3
Supplier Device Package 121-CSFBGA (6x6)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
採購資訊

採購概覽

LCMXO3LF-2100E-6MG121C 的主要供貨及採購資訊。

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料號 LCMXO3LF-2100E-6MG121C
供貨狀態 列示庫存 1,448 pcs 當前數量需確認。
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LCMXO3LF-2100E-6MG121C 詳細描述

Product Overview

The LCMXO3LF-2100E-6MG121C is a MachXO3 field programmable gate array from Lattice Semiconductor Corporation. It uses a 121-VFBGA, CSPBGA package and provides 100 I/O, 2112 logic elements/cells, 264 LABs/CLBs, and 75776 total RAM bits. The device operates from a 1.14 V to 1.26 V supply and has an operating junction temperature range of 0 °C to 85 °C.

Key Features

  • MachXO3 FPGA architecture with 2112 logic elements/cells
  • 264 LABs/CLBs for configurable digital logic
  • 75776 total RAM bits for memory capacity
  • 100 I/O for external interface planning
  • 1.14 V to 1.26 V supply voltage range
  • 121-VFBGA, CSPBGA surface-mount package, 121-CSFBGA (6x6)

Applications

  • Embedded control subsystems requiring custom digital logic
  • Sensor interfacing and local data preprocessing
  • Communication protocol bridging between digital buses
  • Display timing generation and pixel path control
  • Small data buffers and state machine implementation

Design & Procurement Notes

Design teams should verify that the board power network can maintain 1.14 V to 1.26 V during device activity and that assembly processes support the 121-CSFBGA (6x6) surface-mount package. I/O requirements should be mapped against the 100 available I/O, while logic complexity should be budgeted against 2112 logic elements/cells and 264 LABs/CLBs. The 75776 total RAM bits can be considered for small buffers or state storage. Thermal design should keep the junction temperature within 0 °C to 85 °C. Pin assignment should be reviewed during schematic capture to ensure the required external signals fit within the available I/O count.

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