LCMXO2280C-3FTN256C
IC FPGA 211 I/O 256FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LBGA
- 庫存
- 5,394 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 256-FTBGA (17x17) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2280C-3FTN256C 的主要供貨及採購資訊。
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LCMXO2280C-3FTN256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2280C-3FTN256C is a MachXO FPGA provided in a 256-LBGA package, with a supplier device package identified as 256-FTBGA (17x17). The device is surface-mount and includes 211 I/O, 2280 logic elements/cells, 285 LABs/CLBs, and 28262 total RAM bits. Its supply voltage range is 1.71V to 3.465V, and the stated operating temperature range is 0°C to 85°C (TJ). The supplied lifecycle status is Active.
Key Features
- MachXO FPGA with 2280 logic elements/cells and 285 LABs/CLBs.
- 211 I/O for board-level signal connection and logic integration.
- 28262 total RAM bits available for on-device storage.
- 256-LBGA package with 256-FTBGA (17x17) supplier device package.
- Surface-mount mounting type for PCB assembly.
- 1.71V to 3.465V supply voltage range.
- 0°C to 85°C (TJ) operating temperature range.
Applications
- Embedded control logic where available I/O and on-device RAM support custom peripheral interfaces.
- Instrumentation or test equipment functions that use FPGA logic resources for sequencing, processing, or timing-related control.
- Communications hardware that uses FPGA logic and I/O for data routing or buffering within the available resources.
Design & Procurement Notes
When selecting the LCMXO2280C-3FTN256C, verify that the board power supply remains within 1.71V to 3.465V and that the junction temperature stays within 0°C to 85°C (TJ). The 256-LBGA / 256-FTBGA (17x17) surface-mount package requires a compatible PCB land pattern and assembly process. Design margins should be based on the 211 I/O, 2280 logic elements/cells, 285 LABs/CLBs, and 28262 total RAM bits rather than family-level assumptions. The Active lifecycle status is useful for current designs, while the supplied data does not include qualification claims beyond the listed package, temperature, voltage, and mounting information.
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