LCMXO3LF-2100C-6BG324I
IC FPGA 279 I/O 324CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 324-LFBGA
- 庫存
- 1,314 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 324-CABGA (15x15) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3LF-2100C-6BG324I 的主要供貨及採購資訊。
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LCMXO3LF-2100C-6BG324I 詳細描述
Product Overview
The LCMXO3LF-2100C-6BG324I from Lattice Semiconductor Corporation is a MachXO3 field-programmable gate array for configurable digital logic in embedded systems. The device provides 2112 logic elements/cells, 264 LABs/CLBs, and 75776 total RAM bits, with 279 I/O. It uses a 324-CABGA (15x15) surface-mount package, also identified as 324-LFBGA, and operates from a 2.375 V to 3.465 V supply over a junction temperature range of -40°C to 100°C.
Key Features
- MachXO3 FPGA architecture with 2112 logic elements/cells.
- 264 LABs/CLBs and 75776 total RAM bits.
- 279 I/O available in a 324-CABGA (15x15) package.
- Supply voltage range of 2.375 V to 3.465 V.
- Surface-mount device in 324-LFBGA / 324-CABGA (15x15) package.
- Operating temperature range of -40°C to 100°C (TJ).
Applications
- Configurable control logic in embedded equipment.
- I/O expansion and signal mapping for processor or microcontroller boards.
- Small data buffering and state-machine implementation in system designs.
- Hardware prototyping and logic replacement in development platforms.
Design & Procurement Notes
When selecting this device, verify that the 324-CABGA (15x15) / 324-LFBGA footprint and surface-mount assembly process match the board design. The 279 I/O count should be mapped against required external connections, while the 2112 logic elements/cells, 264 LABs/CLBs, and 75776 RAM bits determine available logic and on-chip storage. Power supply planning should account for the 2.375 V to 3.465 V operating range, and thermal design should consider the -40°C to 100°C junction temperature specification.
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