料號

LCMXO3LF-2100C-6BG324C

IC FPGA 279 I/O 324CABGA

封裝
324-LFBGA
庫存
1,303 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series MachXO3
Supplier Device Package 324-CABGA (15x15)
Voltage - Supply 2.375V ~ 3.465V
資料表 查看資料表PDF
採購資訊

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LCMXO3LF-2100C-6BG324C 的主要供貨及採購資訊。

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料號 LCMXO3LF-2100C-6BG324C
供貨狀態 列示庫存 1,303 pcs 當前數量需確認。
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LCMXO3LF-2100C-6BG324C 詳細描述

Product Overview

The LCMXO3LF-2100C-6BG324C is a MachXO3 field-programmable gate array from Lattice Semiconductor Corporation for embedded digital systems. It provides 2,112 logic elements/cells and 264 LABs/CLBs, along with 75,776 total RAM bits for on-chip data storage and buffering. The device offers 279 input/output pins for connection to external subsystems, sensors, interface devices, or logic devices. It operates from a supply voltage range of 2.375 V to 3.465 V and has an operating temperature range of 0°C to 85°C (TJ). The component is in a surface-mount 324-LFBGA package, also identified as 324-CABGA (15x15).

Key Features

  • MachXO3 FPGA with 2,112 logic elements/cells and 264 LABs/CLBs.
  • 75,776 total RAM bits for on-chip data storage and buffering.
  • 279 input/output pins for external subsystem, sensor, interface, and logic connections.
  • 2.375 V to 3.465 V supply voltage range.
  • 0°C to 85°C (TJ) operating temperature range.
  • Surface-mount 324-LFBGA package, also identified as 324-CABGA (15x15).

Applications

  • Embedded control logic and sequencing functions implemented in programmable logic.
  • Sensor and data aggregation with on-chip buffering using 75,776 total RAM bits.
  • Interface bridging and glue logic between subsystems that require multiple I/O connections.

Design & Procurement Notes

When selecting this FPGA, confirm that the board power rail remains within the 2.375 V to 3.465 V supply range and that the device junction temperature stays within 0°C to 85°C under expected conditions. The surface-mount 324-LFBGA/CABGA package should be accounted for in board layout and assembly planning. The 279 I/O pins, 2,112 logic elements/cells, 264 LABs/CLBs, and 75,776 total RAM bits should be mapped against the required pin count, logic density, and buffering needs before finalizing the design.

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