LCMXO3LF-1300E-5UWG36ITR1K
IC FPGA 28 I/O 36WLCSP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 36-UFBGA, WLCSP
- 庫存
- 3,365 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT),Digi-Reel® |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 36-WLCSP (2.54x2.59) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3LF-1300E-5UWG36ITR1K 的主要供貨及採購資訊。
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LCMXO3LF-1300E-5UWG36ITR1K 詳細描述
Product Overview
The LCMXO3LF-1300E-5UWG36ITR1K is a Lattice Semiconductor Corporation MachXO3 field programmable gate array supplied in a 36-UFBGA, WLCSP package. It provides 28 I/O, 1280 logic elements/cells, 160 LABs/CLBs, and 65536 total RAM bits. The device is specified for surface-mount assembly, a supply voltage range of 1.14V ~ 1.26V, and an operating temperature range of -40°C ~ 100°C (TJ). Its compact 36-WLCSP (2.54x2.59) footprint supports embedded logic and interface functions where a programmable gate array is required.
Key Features
- MachXO3 FPGA device from Lattice Semiconductor Corporation with 28 I/O.
- 1280 logic elements/cells and 160 LABs/CLBs.
- 65536 total RAM bits.
- Supply voltage specified as 1.14V ~ 1.26V.
- Operating temperature specified as -40°C ~ 100°C (TJ).
- 36-UFBGA, WLCSP package; supplier device package 36-WLCSP (2.54x2.59); surface mount.
Applications
- Embedded control logic where programmable state machines or glue logic are needed.
- Interface bridging using the available 28 I/O between system components.
- Data buffering or lookup tables using 65536 total RAM bits.
- Compact surface-mount embedded assemblies using the 36-WLCSP (2.54x2.59) footprint.
Design & Procurement Notes
Engineers selecting this part should plan for a 1.14V ~ 1.26V supply and a -40°C ~ 100°C (TJ) thermal envelope. The 36-WLCSP (2.54x2.59) package is surface mount, so board layout, soldering, and inspection should account for the package type. The resource set of 28 I/O, 1280 logic elements/cells, 160 LABs/CLBs, and 65536 RAM bits should be compared with the target design before layout. Lifecycle status is Active as supplied.
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